IP Library › Patent Application 62359225
Patent Application Provisional
App. No. 62/359,225 · Confirmation No. 5242

INTEGRATING SILICON PHOTONICS AND LASER DIES USING FLIP-CHIP TECHNOLOGY

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2016-07-25 APP.FILE.REC Filing Receipt 3 View
2016-07-07 SPEC Specification 5 View
2016-07-07 TR.PROV Provisional Cover Sheet (SB16) 3 View
2016-07-07 WFEE Fee Worksheet (SB06) 2 View
2016-07-07 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
62/359,225
Filed
2016-07-07