Patent Application
Provisional
Small
App. No. 62/410,981
· Confirmation No. 6047
MULTI-LAYER SINGLE CHIP MEMS WLCSP FABRICATION
Applicant:
mCube, Inc.
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2016-11-04 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2016-10-21 | ADS |
Application Data Sheet | 8 | View | |
| 2016-10-21 | SPEC |
Specification | 8 | View | |
| 2016-10-21 | CLM |
Claims | 4 | View | |
| 2016-10-21 | ABST |
Abstract | 1 | View | |
| 2016-10-21 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2016-10-21 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2016-10-21 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Chien Chen LEE
San Jose, CA
Tzu Feng CHANG
San Jose, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 83275
- Docket No.
- A965RO-001000PV
- Confirmation No.
- 6047
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 62/410,981
- Filed
- 2016-10-21
External Links