Patent Application
Provisional
App. No. 62/415,939
· Confirmation No. 6402
SEMICONDUCTOR DIE PACKAGE AND MANUFACTURING METHOD
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2016-11-15 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2016-11-01 | TR.PROV |
Provisional Cover Sheet (SB16) | 4 | View | |
| 2016-11-01 | SPEC |
Specification | 10 | View | |
| 2016-11-01 | DRW |
Drawings-only black and white line drawings | 11 | View | |
| 2016-11-01 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2016-11-01 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Seungwon Im
Bucheon-si, KOREA, REPUBLIC OF
Mankyo Jong
Bucheon-si, KOREA, REPUBLIC OF
Joonseo Son
Seoul, KOREA, REPUBLIC OF
Oseob Jeon
Seoul, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 14912
- Docket No.
- FSC75398US01
- Confirmation No.
- 6402
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 04481, FRAME 0541
Recorded 2023-06-22
PATENT SECURITY AGREEMENT
Recorded 2017-11-17
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2017-11-02
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Quick Facts
- App. No.
- 62/415,939
- Filed
- 2016-11-01
External Links