Semiconductor die package including a one-body clip
In one general aspect, an apparatus can include a semiconductor die, a substrate, and a leadframe coupled to the substrate and defining an opening. The apparatus can include a one-body clip having a first portion disposed within the opening and coupled to the semiconductor die. The one-body clip can have a second portion disposed within the same opening and coupled to the substrate.
1. An apparatus, comprising:
a semiconductor die;
a substrate, the semiconductor die having a bottom surface coupled to the substrate;
a leadframe coupled to the substrate and defining an opening; and
a one-body clip having a first portion disposed within the opening and coupled to a top surface of the semiconductor die, the one-body clip having a second portion disposed within the same opening and coupled to the substrate.
2. The apparatus of claim 1 , wherein the leadframe defines at least a portion of a power terminal.
3. The apparatus of claim 2 , wherein the semiconductor die is located within the opening of the leadframe and separated from the leadframe defining the at least the portion of the power terminal.
4. The apparatus of claim 1 , wherein the opening of the leadframe surrounds at least a portion of the first portion of the one-body clip.
5. The apparatus of claim 1 , wherein the semiconductor die has an outer profile smaller than and disposed within a shape of the opening of the leadframe.
6. The apparatus of claim 1 , wherein a portion of the leadframe is cut from the leadframe to define the one-body clip.
7. The apparatus of claim 1 , wherein the one-body clip has a recess disposed between the first portion and the second portion.
8. The apparatus of claim 1 , wherein the leadframe defines a recess, the leadframe is not contacted on both sides of the recess to the substrate.
9. The apparatus of claim 1 , wherein the one-body clip defines a recess having a profile different from a profile of a recess defined by the leadframe.
10. The apparatus of claim 1 , wherein the substrate includes a dielectric layer disposed between a first metal layer and a second metal layer, the leadframe being coupled to the first metal layer.
11. The apparatus of claim 1 , wherein the semiconductor die is a first semiconductor die,
the apparatus further comprising a second semiconductor die, the second semiconductor die being disposed between a portion of the leadframe and the substrate, the first portion of the one-body clip is aligned within a same plane as the portion of the leadframe.
12. The apparatus of claim 1 , further comprising:
a molding layer encapsulating the semiconductor die.
13. The apparatus of claim 1 , wherein the opening has a least four sides around the one-body clip.
14. An apparatus, comprising:
a first semiconductor die;
a second semiconductor die;
a substrate, the first semiconductor die having a bottom surface coupled to the substrate;
a leadframe having a portion coupled to the substrate and to the second semiconductor die; and
a one-body clip coupled to a top surface of the first semiconductor die and a top surface of the substrate through an opening in the leadframe such that a first portion of the one-body clip coupled to the first semiconductor die is disposed in a first portion of the opening and a second portion of the one-body clip coupled to the substrate is disposed in a second portion of the opening.
15. The apparatus of claim 14 , wherein the leadframe defines at least a portion of a power terminal.
16. The apparatus of claim 14 , wherein the first and second portions of the one-body clip are insulated from the leadframe and separated from the leadframe by the opening.
17. The apparatus of claim 14 , wherein the first semiconductor die coupled to a bottom side of the first portion of the one-body clip, the second semiconductor die is coupled to a bottom side of the portion of the leadframe.
18. The apparatus of claim 14 , wherein the substrate includes a dielectric layer disposed between a first metal layer and a second metal layer.
19. The apparatus of claim 14 , wherein the substrate includes a dielectric layer encapsulated within a molding layer.
20. An apparatus, comprising:
a semiconductor die;
a substrate, the semiconductor die having a bottom surface coupled to the substrate;
a leadframe coupled to the substrate, the leadframe including an opening; and
a one-body clip having a first portion, a second portion, and a recess disposed between the first portion and the second portion,
the first portion of the one-body clip being disposed within the opening and coupled to top surface of the semiconductor die, the one-body clip having the second portion disposed within the opening and coupled to the substrate.
21. The apparatus of claim 20 , wherein the leadframe defines a recess, the recess of the one-body clip has a profile different from a profile of the recess defined by the leadframe.