Patent Assignment
Reel/Frame 051963/0886
Assignment of Assignor's Interest
Recorded: 2020-02-28
Pages: 4
Assignors
IM, SEUNGWON
Executed: 2017-10-11
JEON, OSEOB
Executed: 2017-10-11
SON, JOONSEO
Executed: 2017-10-25
Assignee
FAIRCHILD KOREA SEMICONDUCTOR LTD.
55, PYEONGCHEON-RO 850 BEON-GIL, WONMI-GU, GYEONGGI-DO, BUCHEON, 14487, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Die Package Including a One-Body Clip
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 28, 2020
From: FAIRCHILD KOREA SEMICONDUCTOR LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 052049/0580 →
Security Interest
May 13, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 052656/0842 →
Release of Security Interest in Patents Recorded at Reel 052656, Frame 0842
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064080/0149 →