IP Library Assignment 052049/0580
Patent Assignment
Reel/Frame 052049/0580

Assignment of Assignor's Interest

Recorded: 2020-02-28 Pages: 46
Assignor
FAIRCHILD KOREA SEMICONDUCTOR LTD.
Executed: 2017-11-02
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semiconductor Die Package Including a One-Body Clip
Application: 16/804,662 →
Publication: US 2020/0194346
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 28, 2020
From: IM, SEUNGWON; JEON, OSEOB; SON, JOONSEO
To: FAIRCHILD KOREA SEMICONDUCTOR LTD.
Reel/Frame 051963/0886 →
Security Interest May 13, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 052656/0842 →
Release of Security Interest in Patents Recorded at Reel 052656, Frame 0842 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064080/0149 →