Patent Application
Provisional
App. No. 62/856,918
· Confirmation No. 6678
HEAT TRANSFER FOR POWER MODULES
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2019-06-11 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2019-06-04 | ADS |
Application Data Sheet | 9 | View | |
| 2019-06-04 | ABST |
Abstract | 1 | View | |
| 2019-06-04 | CLM |
Claims | 4 | View | |
| 2019-06-04 | SPEC |
Specification | 17 | View | |
| 2019-06-04 | DRW |
Drawings-only black and white line drawings | 12 | View | |
| 2019-06-04 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2019-06-04 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Inpil YOO
Unterhaching, GERMANY
Jerome TEYSSEYRE
Scottsdale, AZ
Seungwon IM
Seoul, KOREA, REPUBLIC OF
Dongwook KANG
Bucheon-si, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 14912
- Docket No.
- ONS03280L01(B)US
- Confirmation No.
- 6678
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 050156, FRAME 0421
Recorded 2023-08-16
SECURITY INTEREST
Recorded 2019-08-23
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Quick Facts
- App. No.
- 62/856,918
- Filed
- 2019-06-04
External Links