IP Library › Patent Application 63004766
Patent Application Provisional
App. No. 63/004,766 · Confirmation No. 7782

STACKED RF CIRCUIT TOPOLOGY USING TRANSISTOR DIE WITH THROUGH SILICON CARBIDE VIAS ON GATE AND/OR DRAIN

Provisional Application Expired
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 Code Description Pages PDF
2020-04-16 APP.FILE.REC Filing Receipt 3 View
2020-04-03 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
2020-04-03 PD.TO.AUTH Authorization or Rescission of Authorization to Access Application by Digital Access Service /Priority Document Exchange Office 1 View
2020-04-03 WFEE Fee Worksheet (SB06) 2 View
2020-04-03 N417 Electronic Filing System Acknowledgment Receipt 3 View
2020-04-03 TR.PROV Provisional Cover Sheet (SB16) 4 View
2020-04-03 DRW.NONBW Drawings-other than black and white line drawings 12 View
2020-04-03 SPEC Specification 36 View
2020-04-03 CLM Claims 4 View
2020-04-03 ABST Abstract 1 View
2020-04-03 DRW.SUPP Drawings-black and white line and/or other drawings — View
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Quick Facts
App. No.
63/004,766
Filed
2020-04-03