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App. No. 18/502,334 · Confirmation No. 1005

STACKED RF CIRCUIT TOPOLOGY USING TRANSISTOR DIE WITH THROUGH SILICON CARBIDE VIAS ON GATE AND/OR DRAIN

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Quick Facts
App. No.
18/502,334
Filed
2023-11-06
Pub. No.
US20240071962A1
Art Unit
2843