IP Library Patent Application 63064958
Patent Application Provisional
App. No. 63/064,958 · Confirmation No. 6767

3D TOOTHED BOND PADS FOR HETEROGENEOUS DIE INGETRATION IN AN INTEGRATED CIRCUIT (IC) STRUCTURE

Provisional Application Expired
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Code Description Pages PDF
2024-12-11 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2020-08-21 APP.FILE.REC Filing Receipt 3 View
2020-08-13 PA.. Power of Attorney 1 View
2020-08-13 WFEE Fee Worksheet (SB06) 2 View
2020-08-13 N417 Electronic Filing System Acknowledgment Receipt 3 View
2020-08-13 TR.PROV Provisional Cover Sheet (SB16) 4 View
2020-08-13 ADS Application Data Sheet 9 View
2020-08-13 CLM Claims 1 View
2020-08-13 SPEC Specification 38 View
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Quick Facts
App. No.
63/064,958
Filed
2020-08-13