IP Library › Patent Application 63117310
Patent Application Provisional Small
App. No. 63/117,310 · Confirmation No. 9526

METHOD TO VARY HEAT DISSIPATION CAPABILITY FOR PHOTONIC INTEGRATED CIRCUITS ON SILICON-ON-INSULATOR (SOI) WAFERS

Inventors: Sen Lin, Lei Wang
Provisional Application Expired
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 Code Description Pages PDF
2023-12-14 LET. Miscellaneous Incoming Letter — View
2023-12-14 N417 Electronic Filing System Acknowledgment Receipt 2 View
2023-12-14 TRAN.LET Transmittal Letter 1 View
2023-12-14 PA.. Power of Attorney 2 View
2023-12-14 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2023-10-19 N572 Response - Re: Informal Power of Attorney (PTOL-308) 1 View
2023-10-06 PA.. Power of Attorney — View
2023-10-06 N417 Electronic Filing System Acknowledgment Receipt 2 View
2023-10-06 PA.. Power of Attorney 2 View
2023-10-06 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2023-03-10 N572 Response - Re: Informal Power of Attorney (PTOL-308) 1 View
2023-03-06 PA.. Power of Attorney 2 View
2023-03-06 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2023-03-06 N417 Electronic Filing System Acknowledgment Receipt 2 View
2023-03-01 N572 Response - Re: Informal Power of Attorney (PTOL-308) 2 View
2023-02-23 PA.. Power of Attorney 2 View
2023-02-23 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2023-02-23 N417 Electronic Filing System Acknowledgment Receipt 2 View
2020-12-18 APP.FILE.REC Filing Receipt 3 View
2020-11-23 PA.. Power of Attorney 2 View
2020-11-23 DRW Drawings-only black and white line drawings 4 View
2020-11-23 WFEE Fee Worksheet (SB06) 2 View
2020-11-23 N417 Electronic Filing System Acknowledgment Receipt 3 View
2020-11-23 ADS Application Data Sheet 8 View
2020-11-23 SPEC Specification 1 View
2020-11-23 CLM Claims 1 View
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Quick Facts
App. No.
63/117,310
Filed
2020-11-23