Patent Application
Provisional
App. No. 63/121,047
· Confirmation No. 2074
SEMICONDUCTOR DEVICE WITH REDUCED STRESS DIE PICK AND PLACE
Applicant:
WESTERN DIGITAL TECHNOLOGIES, INC.
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2020-12-08 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2020-12-03 | ADS |
Application Data Sheet | 9 | View | |
| 2020-12-03 | ABST |
Abstract | 1 | View | |
| 2020-12-03 | CLM |
Claims | 4 | View | |
| 2020-12-03 | SPEC |
Specification | 12 | View | |
| 2020-12-03 | DRW |
Drawings-only black and white line drawings | 9 | View | |
| 2020-12-03 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2020-12-03 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Xin Tian
Shanghai, CHINA
Junrong Yan
Shanghai, CHINA
Chee Keong Chin
Shanghai, CHINA
Weili Wang
Shanghai, CHINA
Yang Lei
Shanghai, CHINA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 64948
- Docket No.
- SAND-02511US0
- Confirmation No.
- 2074
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 63/121,047
- Filed
- 2020-12-03
External Links