Patent Application
Provisional
App. No. 63/124,198
· Confirmation No. 6561
SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTIPLE LEAD FRAMES AND RELATED METHODS
Inventor:
Julius Andy Kovats
Applicant:
Microchip Technology Incorporated
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2020-12-14 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2020-12-11 | ADS |
Application Data Sheet | 8 | View | |
| 2020-12-11 | SPEC |
Specification | 10 | View | |
| 2020-12-11 | CLM |
Claims | 3 | View | |
| 2020-12-11 | ABST |
Abstract | 1 | View | |
| 2020-12-11 | APPENDIX |
Appendix to the specification | 9 | View | |
| 2020-12-11 | DRW |
Drawings-only black and white line drawings | 2 | View | |
| 2020-12-11 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2020-12-11 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Julius Andy Kovats
Manitou Springs, CO
Attorneys & Agents of Record
Prosecution
- Customer No.
- 145922
- Docket No.
- 3780-16067(20130US01)
- Confirmation No.
- 6561
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 63/124,198
- Filed
- 2020-12-11
External Links