IP Library › Patent Application 63134402
Patent Application Provisional
App. No. 63/134,402 · Confirmation No. 5446

SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE PATHWAYS

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2021-04-12 APP.FILE.REC Filing Receipt 3 View
2021-01-06 ADS Application Data Sheet 9 View
2021-01-06 TR.PROV Provisional Cover Sheet (SB16) 4 View
2021-01-06 DRW Drawings-only black and white line drawings 4 View
2021-01-06 SPEC Specification 12 View
2021-01-06 CLM Claims 3 View
2021-01-06 ABST Abstract 1 View
2021-01-06 WFEE Fee Worksheet (SB06) 2 View
2021-01-06 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
63/134,402
Filed
2021-01-06