IP Library › Patent Application 63454490
Patent Application Provisional
App. No. 63/454,490 · Confirmation No. 9308

THREE-DIMENSIONAL INTEGRATED CIRCUIT WITH A CHIPPING AND DELAMINATION BARRIER AND ITS FABRICATION METHOD

Applicant: pSemi Corporation
Provisional Application Expired
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 Code Description Pages PDF
2024-09-25 R48.REQ.G Acceptance of Request under Rule 48 to correct inventorship or name 1 View
2024-09-25 APP.FILE.REC Filing Receipt 3 View
2024-09-20 N417.PYMT Electronic Fee Payment 2 View
2024-09-20 R48.REQ Request under Rule 48 correcting inventorship 2 View
2024-09-20 ADS Application Data Sheet 9 View
2024-09-20 N417 Electronic Filing System Acknowledgment Receipt 2 View
2024-07-01 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2024-07-01 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2024-06-13 N417 Electronic Filing System Acknowledgment Receipt 2 View
2024-06-13 PA.. Power of Attorney 2 View
2023-04-06 APP.FILE.REC Filing Receipt 3 View
2023-03-24 APPENDIX.SUPP Appendix to the specification — View
2023-03-24 PA.. Power of Attorney 2 View
2023-03-24 TR.PROV Provisional Cover Sheet (SB16) 3 View
2023-03-24 DRW Drawings-only black and white line drawings 11 View
2023-03-24 APPENDIX Appendix to the specification 8 View
2023-03-24 WFEE Fee Worksheet (SB06) 2 View
2023-03-24 N417 Electronic Filing System Acknowledgment Receipt 3 View
2023-03-24 ADS Application Data Sheet 9 View
2023-03-24 SPEC Specification 17 View
2023-03-24 CLM Claims 4 View
2023-03-24 ABST Abstract 1 View
2023-03-24 APPENDIX Appendix to the specification 1 View
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Quick Facts
App. No.
63/454,490
Filed
2023-03-24