IP Library › Granted Patent US 50,609
Granted Patent E1
US 50,609 · App. 18/086,978 · Granted Sep 30, 2025

Filter assemblies, tuning elements and method of tuning a filter

Inventors: Roman Tkadlec (Valasske Kiobouky, CZ); Yongjie Xu (Shanghai, CN); Richard Brown (Forest, VA); Giuseppe Resnati (Seregno, IT); Omar Parimbelli (Lallio, IT); Sammit Patel (Richardson, TX)
Assignee: Outdoor Wireless Networks LLC
H01P1/207H01P1/20345H01P1/2135H01P1/2138H01P7/06H01P7/088
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Quick Facts
Patent No.
US 50,609
App. No.
18/086,978
Granted
Sep 30, 2025
Kind
E1
Abstract

The present invention provides filter assemblies, tuning elements and a method of tuning a filter. A filter assembly includes a housing having a top cover, a bottom cover and at least one sidewall, the top cover, the bottom cover and the at least one sidewall defining an internal cavity, the housing configured to receive first through third radio frequency (“RF”) transmission lines; a top metal sheet mounted within the internal cavity that has a plurality of openings that form a first hole pattern; and a bottom metal sheet mounted within the internal cavity that has a plurality of openings that form a second hole pattern. The top and bottom metal sheets are vertically spaced-apart from each other in a vertically stacked relationship within the internal cavity. The top metal sheet and the bottom metal sheet each include at least one resonator.

Claims (36)

1. A filter assembly comprising:

a housing having a top cover, a bottom cover, and a frame that has at least one sidewall, wherein the top cover, the bottom cover and the at least one sidewall define an internal cavity, and wherein the housing is configured to receive a plurality of radio frequency (“RF”) transmission lines; and

a resonator plate mounted at least partially within the internal cavity of the housing, the resonator plate comprising a first conductive layer comprising at least one resonator,

wherein a first type of solder having a first melting point is used to solder attaches the resonator plate to the housing frame, and wherein a second type of solder having a second melting point that is lower than the first melting point is used to solder attaches the top cover and/or the bottom cover to the housing frame.

2. The filter assembly of claim 1 , wherein the resonator plate comprises a printed circuit board.

3. The filter assembly of claim 2 , wherein the at least one resonator is attached to the printed circuit board.

4. The filter assembly of claim 1 , wherein the first conductive layer comprises a plurality of openings that form a hole pattern.

5. The filter assembly of claim 1 , wherein the resonator plate is soldered to the housing via a first continuous solder joint that extends around an internal periphery of the housing.

6. The filter assembly of claim 1 , wherein the resonator plate is soldered attached to an internal ledge of the frame, the internal ledge extending from the at least one sidewall of the housing frame.

7. The filter assembly of claim 6 , wherein the resonator plate comprises a metal border on a face of the resonator plate to facilitate soldering the resonator plate to the internal ledge.

8. The filter assembly of claim 1 , wherein at least one of the top cover or the bottom cover comprises an integral tuning element.

9. The filter assembly of claim 1 , wherein the resonator plate comprises a second conductive layer on a side of the resonator plate that is opposite the first conductive layer.

10. A filter assembly comprising:

a housing having a top cover, a bottom cover, and a sidewall, the top cover, the bottom cover and the sidewall defining an internal cavity; and

a printed circuit board mounted at least partially within the housing, the printed circuit board comprising a conductive layer that comprises a plurality of resonating elements that form part of a resonant cavity filter,

wherein the sidewall comprises a slot, and wherein a portion of the printed circuit board extends through the slot to reside outside the housing,

wherein at least one of the top cover or the bottom cover comprises an integral tuning element.

11. The filter assembly of claim 10 , wherein a phase shifter assembly is provided on the printed circuit board.

12. The filter assembly of claim 11 , wherein the printed circuit board further comprises a plurality of radio frequency (“RF”) transmission lines that extend from outside the housing to inside the housing.

13. A filter assembly comprising:

a housing having a top cover, a bottom cover, and a frame that includes at least one sidewall, wherein the top cover, the bottom cover and the at least one sidewall define an internal cavity;

a plurality of resonators in the internal cavity; and

a twistable tuning element that is integral with the top cover,

wherein at least one of the plurality of resonators includes a narrow base and a widened distal end, and

wherein the plurality of resonators are integral with the frame and aligned in a first plane that is parallel to a plane defined by the top cover.

14. The filter assembly of claim 13 , wherein the bottom cover is integral with the frame.

15. The filter assembly of claim 13 , wherein the top cover is attached to the frame via a continuous solder joint that extends all the way around a periphery of the frame.

16. The filter assembly of claim 13 , wherein the twistable tuning element includes a first arm, a second arm and a coupling element, wherein the coupling element is configured to rotate as the coupling element is displaced into the internal cavity.

17. The filter assembly of claim 16 , wherein the twistable tuning element includes a total of two or three arms.

18. A filter assembly, comprising; :

a housing that defines an internal cavity, the housing comprising at least one cover and a frame; and

a substantially planar metal resonator plate mounted within the internal cavity, the substantially planar metal resonator plate comprising a conductive layer comprising at least one resonator,

wherein at least the conductive layer and a size and shape of the internal cavity are configured to achieve a pre-selected filter response, and

wherein a first type of solder having a first melting point is used to solder attaches the substantially planar metal resonator plate to the housing frame, and wherein a second type of solder having a second melting point that is lower than the first melting point is used to solder attaches the at least one cover to the housing frame.

19. The filter assembly of claim 18 , wherein the substantially planar metal resonator plate comprises a printed circuit board.

20. The filter assembly of claim 18 , wherein the substantially planar metal resonator plate is soldered attached to an internal ledge of the frame, the internal ledge extending from a sidewall of the housing frame.

Priority Claims (2)
CN 201511036066.7 · Nov 13, 2015 · national
CN 201610596975.4 · Jul 26, 2016 · national
Continuity (4)
Continuation 16039366 · Jul 19, 2018
Continuation 15349559 · Nov 11, 2016
Provisional Application 62377082 · Aug 19, 2016
Reissue 16674240 · Nov 5, 2019
References Cited (49)
US 4488132A · Collins et al. · 1984 [cited by applicant]
US 5028896A · Kuokkanen · 1991 [cited by applicant]
US 5329687A · Scott · 1994 [cited by examiner]
US 5352996A · Kawaguchi · 1994 [cited by applicant]
US 5550519A · Korpela · 1996 [cited by applicant]
US 5905416A · Schmid et al. · 1999 [cited by applicant]
US 5959511A · Pasco et al. · 1999 [cited by applicant]
US 6111484A · Henningsson et al. · 2000 [cited by applicant]
US 6198363B1 · Vuoppola et al. · 2001 [cited by applicant]
US 6255917B1 · Scott · 2001 [cited by examiner]
US 6329949B1 · Barnett et al. · 2001 [cited by applicant]
US 6384699B1 · Henningsson et al. · 2002 [cited by applicant]
US 6414250B1 · Inoue et al. · 2002 [cited by applicant]
US 10050323B2 · Tkadlec · 2018 [cited by examiner]
US 20010038701A1 · Corynen · 2001 [cited by applicant]
US 20050040913A1 · Galaz et al. · 2005 [cited by applicant]
US 20080315969A1 · Tascone et al. · 2008 [cited by applicant]
US 20090128263A1 · Hesselbarth · 2009 [cited by applicant]
US 20110121919A1 · Tachibana et al. · 2011 [cited by applicant]
US 20110227673A1 · Patrick et al. · 2011 [cited by applicant]
US 20120068789A1 · Jones et al. · 2012 [cited by applicant]
US 20130271243A1 · Haunberger et al. · 2013 [cited by applicant]
US 20140077899A1 · Huang · 2014 [cited by applicant]
US 20150280318A1 · Yang · 2015 [cited by applicant]
US 20150288043A1 · Buchauer · 2015 [cited by examiner]
CN 1476735 · 2004 [cited by applicant]
CN 1476735A · 2004 [cited by applicant]
CN 1518012 · 2004 [cited by applicant]
CN 1518012A · 2004 [cited by applicant]
CN 101048257 · 2007 [cited by applicant]
CN 101048257A · 2007 [cited by applicant]
CN 101378142 · 2009 [cited by applicant]
CN 101378142A · 2009 [cited by applicant]
CN 102904000 · 2013 [cited by applicant]
CN 102904000A · 2013 [cited by applicant]
CN 103035988 · 2013 [cited by applicant]
CN 103035988A · 2013 [cited by applicant]
CN 103262338 · 2013 [cited by applicant]
CN 103262338A · 2013 [cited by applicant]
CN 104126247 · 2014 [cited by applicant]
CN 104126247A · 2014 [cited by applicant]
WO 201329817 · 2013 [cited by applicant]
WO 2013029817A1 · 2013 [cited by applicant]
“Notification of First Office Action (with translation), corresponding to Chinese Patent Application No. 201610596975.4, mailed Oct. 9, 2018”. [cited by applicant]
“Notification of Second Office Action (with translation), corresponding to Chinese Patent Application No. 201610596975.4, mailed Jun. 4, 2019.”. [cited by applicant]
“Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority or the Declaration, for PCT/CN2016/105712, Feb. 21, 2017, pp. 12 pages”. [cited by applicant]
“Supplementary European Search Report in corresponding European Application No. 16863701.5-1205 (Jun. 6, 2019)”. [cited by applicant]
Huang Wang et al., “An Inline Coaxial Quasi-Elliptic Filter With Controllable Mixed Electric and Magnetic Coupling,” IEEE Transactions on Microwave Theory and Techniques, vol. 57, No. 3, Mar. 2009, pp. 667-673. [cited by applicant]
Qing-Xin Chu et al., “A Compact Open-Loop Filter With Mixed Electric and Magnetic Coupling,” IEEE Transactions on Microwave Theory and Techniques, vol. 56, No. 2, Feb. 2008, pp. 431-439. [cited by applicant]