IP Library › Granted Patent US 690,278
Granted Patent S1
US 690,278 · App. 29/413,539 · Granted Sep 24, 2013

Adhesive tape for semiconductor manufacturing

Inventors: Kouhei Taniguchi (Ichihara, JP); Takayuki Matsuzaki (Ichihara, JP); Shinya Katou (Ichihara, JP); Kouji Komorida (Ichihara, JP); Michio Mashino (Ichihara, JP); Tatsuya Sakuta (Ichihara, JP); Rie Katou (Ichihara, JP)
Assignee: Hitachi Chemical Company, Ltd.
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Quick Facts
Patent No.
US 690,278
App. No.
29/413,539
Granted
Sep 24, 2013
Kind
S1
Claims (1)

The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
CHANGE OF ADDRESS Recorded Jul 13, 2013
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 030793/0939 →
Priority Claims (1)
JP D2010-024763 · Oct 15, 2010 · national
Continuity (1)
Continuation 29389794 · Apr 15, 2011