Smart card or similar electronic device

1. An electronic device comprising:

at least one interface element composed of a terminal block with contacts and/or an antenna;

a microcircuit embedded in a carrier medium and having exit hubs; and

connections between the exit hubs and the interface elements that are formed by a low-viscosity conductive substance which remains flexible after application and polymerization.

2. An electronic device according to claim 1 , wherein the interface element includes a terminal block, and the terminal block comprises said low-viscosity conductive substance.

3. An electronic device according to claim 1 , wherein the interface element includes an antenna, and antenna comprises said low-viscosity conductive substance.

4. An electronic device according claim 1 , wherein the conductive substance is a polymer resin containing conductive particles.

5. An electronic device according to claim 1 , wherein the conductive substance is a polymer resin containing intrinsically conductive particles.

6. An electronic device according to claim 4 , wherein the carrier medium comprises a thermoplastic material,

and wherein an activation temperature of the conductive substance is lower than a melting point of the thermoplastic material.

7. An electronic device according claim 1 , wherein the exit hubs have a rust-resistant metallization.

8. An electronic device according to claim 2 , wherein

the carrier medium has a cavity,

the interface element comprises a terminal block with contacts,

the microcircuit is fixed with its active face upwards in the cavity,

the terminal block and the connections comprise said low-viscosity conductive substance, and

the microcircuit is encapsulated.

9. An electronic device according to claim 8 , wherein the microcircuit has contact bumps.

10. An electronic device according to claim 8 , wherein the cavity has a recess at its bottom adapted to receive the microcircuit.

11. An electronic device according to claim 1 ,

wherein electronic device is a contactless chip card or an electronic label,

the interface element is a flat antenna,

the microcircuit is attached to the carrier medium with an active face of the microcircuit facing upwards, and

the connections between the exit hubs of the microcircuit and the hubs of the flat antenna comprise said low-viscosity conductive substance.

12. An electronic device according to claim 1 ,

wherein electronic device is a contactless smart card or an electronic label,

the interface element comprises a flat antenna formed from said low-viscosity conductive substance,

the microcircuit has contact bumps, and

the microcircuit is attached to the carrier medium with an active face of the microcircuit facing downward.

13. An electronic device according to claim 1 , comprising:

an insulating adhesive disposed on the carrier medium, and

a flat antenna formed on the microcircuit by said low-viscosity conductive substance,

wherein the microcircuit is attached to the carrier medium with an active face of the microcircuit facing upward, and

wherein the electronic device is co-laminated.

14. An electronic device according to claim 2 , wherein

the electronic device is a hybrid card having a terminal block and having an antenna incorporated in the carrier medium,

the carrier medium has a cavity,

the microcircuit is attached in the cavity with an active face of the microcircuit facing upward,

the terminal block and the connections comprise said low-viscosity conductive substance, and

the microcircuit is encapsulated.

15. An electronic device according to claim 14 , wherein the microcircuit has contact bumps.

16. An electronic device comprising:

at least one interface element composed of a terminal block with contacts and/or an antenna;

a microcircuit embedded in carrier medium and having exit hubs linked to the interface elements;

wherein connections between the exit hubs and the interface elements comprise a conductive substance which remains flexible after application and polymerization, the conductive substance having low-viscosity when the connections are formed.