Solid-state imaging apparatus and manufacturing method thereof
A structure member is used wherein a circuit board is connected to a solid-state image pickup element and placed between a portion of the structure member to which the solid-state image pickup element is attached, and another portion to which a light-transmitting member is attached, and the circuit board is sealed integrally into the structure member. The solid-state image pickup element is attached to a through-opening portion 1 C, and a light-transmitting member is attached so as to cover the through-opening portion 1 C with being separated from the solid-state image pickup element by a predetermined distance. In a process of molding the structure member, the circuit board is integrally molded, whereby the manpower can be reduced, and the structures of the attaching portions can be simplified to miniaturize the device.
1. A solid-state imaging apparatus comprising:
a structure member configured by an insulating resin, and which has a through-opening portion;
a solid-state image pickup element attached to said structure member;
a light-transmitting member attached to said structure member to cover the through-opening portion with being separated from said solid-state image pickup element by a predetermined distance; and
a fixing member sealed integrally into said structure member and disposed between a portion where said image pickup element is attached and a portion where said light-transmitting member is attached,
wherein said fixing member is a circuit board connected to said solid-state image pickup element.
2. The solid-state imaging apparatus according to claim 1 ,
wherein the circuit board is a multilayer wiring board having a conductor pattern, and a part of the circuit board is exposed from a portion to which said solid-state image pickup element is attached,
wherein said solid-state image pickup element is disposed in a face-down manner and directly connected to said conductor pattern of the circuit board.
3. The solid-state imaging apparatus according to claim 1 ,
wherein the circuit board includes a signal processing circuit which processes an output signal of said solid-state image pickup element.
4. The solid-state imaging apparatus according to claim 3 ,
wherein the signal processing circuit is a chip component which is connected to a first face of the circuit board, the first face being on a side where said light-transmitting member is attached.
5. The solid-state imaging apparatus according to claim 1 ,
wherein the circuit board is configured by an annular member including a through-hole provided in a region corresponding to said through-opening portion to which said light-transmitting member is attached, and said light-transmitting member is fixed to the portion of the circuit board to which said light-transmitting member is attached.
6. The solid-state imaging apparatus according to claim 1 ,
wherein the circuit board comprises a multilayer wiring board,
wherein a conductor pattern is exposed on a side of a face on which said solid-state image pickup element is mounted,
wherein a solid-state image pickup element is directly connected to said conductor pattern.
7. The solid-state imaging apparatus according to claim 1 , wherein said light-transmitting member is configured by forming a dielectric thin film of a multilayer structure on a surface of quartz glass.
8. The solid-state imaging apparatus according to claim 1 , wherein said light-transmitting member is made of thermosetting resin.
9. The solid-state imaging apparatus according to claim 1 , wherein said light-transmitting member is an optical filter.
10. A solid-state imaging apparatus comprising:
a structure member configured by an insulating resin, and which has a through-opening portion;
a solid-state image pickup element attached to said structure member;
a light-transmitting member attached to said structure member to cover the through-opening portion with being separated from said solid-state image pickup element by a predetermined distance; and
a fixing member sealed integrally into said structure member and disposed between a portion where said image pickup element is attached and a portion where said light-transmitting member is attached,
wherein said structure member has a leg portion, and a cylindrical body portion which is disposed on said leg portion, wherein said through-opening portion is formed in the interface between the leg portion and the cylindrical body portion.
11. The solid-state imaging apparatus according to claim 10 ,
wherein said fixing member is a circuit board connected to said solid-state image pickup element and configured by a multilayer wiring board,
wherein the multilayer wiring board is electrically connected to a conductor pattern formed on a part of a surface of the leg portion.
12. The solid-state imaging apparatus according to claim 10 ,
wherein fixing member is a circuit board connected to said solid-state image pickup element and configured by a multilayer wiring board,
wherein said multilayer wiring board is configured by a material which is smaller in coefficient of thermal expansion than the insulating resin.