Data processing for monitoring chemical mechanical polishing
Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.
1. A method for monitoring polishing of a substrate, the method comprising:
scanning a sensor across the substrate to acquire measurement data including two or more measurements, each measurement corresponding to a zone on the substrate and having a value affected by a property of the substrate in the respective zone, wherein at least one of the two or more measurements is acquired by an eddy current based measuring system;
modifying the acquired measurement data using reference data to compensate for distortions in the acquired measurement data caused by the sensor scanning across the substrate; and
evaluating the property of the substrate based on the modified measurement data.
2. A method for monitoring polishing of a substrate, the method comprising:
scanning a sensor across the substrate to acquire measurement data including two or more measurements, each measurement corresponding to a zone on the substrate and having a value affected by a property of the substrate in the respective zone;
modifying the acquired measurement data using reference data to compensate for distortions in the acquired measurement data caused by the sensor scanning across the substrate, including using the reference data to compensate for local sensitivity changes of the sensor as the sensor scans across the substrate, wherein using the reference data to compensate for local sensitivity changes includes dividing the value of one or more acquired measurements by a corresponding sensitivity value that is based on the reference data to compensate for local sensitivity changes of the sensor; and
evaluating the property of the substrate based on the modified measurement data.
3. A method for monitoring polishing of a substrate, the method comprising:
scanning a sensor across the substrate to acquire measurement data including two or more measurements, each measurement corresponding to a zone on the substrate and having a value affected by a property of the substrate in the respective zone;
modifying the acquired measurement data using reference data to compensate for distortions in the acquired measurement data caused by the sensor scanning across the substrate, including using the reference data to compensate for local bias changes in the acquired measurement data as the sensor scans across the substrate, wherein using the reference data to compensate for local bias changes includes subtracting one or more reference values from the value of corresponding acquired measurements, the one or more reference values being based on the reference data to compensate for local bias changes; and
evaluating the property of the substrate based on the modified measurement data.
4. A method for monitoring polishing of a substrate, the method comprising:
scanning a sensor across the substrate to acquire measurement data including two or more measurements, each measurement corresponding to a zone on the substrate and having a value affected by a property of the substrate in the respective zone;
modifying the acquired measurement data using reference data to compensate for distortions in the acquired measurement data caused by the sensor scanning across the substrate, including compensating for signal loss caused by the sensor scanning across an edge of the substrate;
evaluating the property of the substrate based on the modified measurement data.
5. The method of claim 4 wherein:
compensating for signal loss caused by the sensor scanning across an edge of the substrate includes calculating one or more reference points characterizing overlaps of the sensor and the substrate.
6. A method for monitoring polishing of a substrate, comprising:
generating a reference trace representing a scan of a sensor of an in-situ monitoring system across a face of the substrate prior to a polishing step;
polishing the substrate in a chemical mechanical polishing system;
during polishing, generating a measurement trace by scanning the sensor of the in-situ monitoring system across the face of the substrate;
modifying the measurement trace using the reference trace, including subtracting the reference trace from the measurement trace; and
detecting a polishing endpoint from the modified measurement trace.
7. A method for monitoring polishing of a substrate, comprising:
generating a reference trace representing a scan of a sensor of an in-situ monitoring system across a face of the substrate prior to a polishing step;
polishing the substrate in a chemical mechanical polishing system;
during polishing, generating a measurement trace by scanning the sensor of the in-situ monitoring system across the face of the substrate;
modifying the measurement trace using the reference trace, including dividing the measurement trace by the reference trace; and
detecting a polishing endpoint from modified measurement trace.
8. The method of claim 7 wherein the reference trace comprises a normalized sensitivity function.
9. The method of claim 7 , wherein generating the reference trace includes calculating an overlap between a sensing region of the sensor and the substrate.