Die cleaning method
There is disclosed a die cleaning method for removing a forming-material from a die used in forming the forming-material containing a binder, comprising the steps of: removing a part or all of the binder contained in the forming-material from the die; and removing the forming-material from the die, whereby the forming-material in the die can be removed without damaging or deforming the die for use in forming the forming-material containing the binder.
1. A die cleaning method for removing a forming-material from a die used in forming the forming-material constituted of clay containing a binder, comprising the steps of:
removing a part or all of the binder contained in the forming-material from the die; and
removing the forming-material from the die after removing a part or all of the binder.
2. The die cleaning method according to claim 1 , wherein the step of removing a part or all of the binder is performed by heating the die.
3. The die cleaning method according to claim 2 , wherein a heating temperature is in a range of 200 to 500° C.
4. The die cleaning method according to claim 1 , wherein the step of removing the forming-material is performed by spraying a fluid to the die at a pressure of 40 kg/cm 2 or less.
5. The die cleaning method according to claim 1 , wherein the die includes a member constituted of cemented carbide.
6. The die cleaning method according to claim 1 , wherein the die includes a member having slits.