IP Library Granted Patent US 7,056,850
Granted Patent B2
US 7,056,850 · App. 10/484,717 · Granted Jun 6, 2006

Wear-resistant silicon nitride member and method of manufacture thereof

Assignee: Kabushiki Kaisha Toshiba
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Quick Facts
Patent No.
US 7,056,850
App. No.
10/484,717
Granted
Jun 6, 2006
Kind
B2
Abstract

The present invention provides a wear resistant member composed of silicon nitride sintered body containing 2–10 mass % of rare earth element in terms of oxide thereof as sintering agent, 2–7 mass % of MgAl 2 O 4 spinel, 1–10 mass % of silicon carbide, and 5 mass % or less of at least one element selected from the group consisting of Ti, Zr, Hf, W, Mo, Ta, Nb and Cr in terms of oxide thereof, wherein a porosity of said silicon nitride sintered body is 1 vol. % or less, a three-point bending strength is 900 MPa or more, and a fracture toughness is 6.3 MPa·m 1/2 or more. According to the above structure of the present invention, there can be provided a silicon nitride wear resistant member and a method of manufacturing the member having a high strength and a toughness property, and particularly excellent in rolling and sliding characteristics.

Claims (16)

1. A wear resistant member composed of silicon nitride sintered body containing 2–10 mass% of rare earth element in terms of oxide thereof as sintering agent, 2–7 mass % of MgAl 2 O 4 spinel, 1–7 mass % of silicon carbide, and 0.5–5 mass % of at least one element selected from the group consisting of Ti, Zr, Hf, W, Mo, Ta, Nb and Cr in terms of oxide thereof, wherein a porosity of said silicon nitride sintered body is 1 vol. % or less, a three-point bending strength is 900 MPa or more, a fracture toughness is 6.3 MPa·m 1/2 or more, and a maximum width of aggregated segregation existing in grain boundary phase of the silicon nitride sintered body is 5 μm or less.

2. A wear resistant member composed of silicon nitride sintered body containing 2–10 mass % of rare earth element in terms of oxide thereof as sintering agent, 2–7 mass % of MgAl 2 O 4 spinel, 1–7 mass % of silicon carbide, and 0.5–5 mass % of at least one element selected from the group consisting of Ti, Zr, Hf, W, Mo, Ta, Nb and Cr in terms of oxide thereof, wherein a porosity of said silicon nitride sintered body is 1 vol. % or less, a three-point bending strength is 900 MPa or more, a fracture toughness is 6.3 MPa·m 1/2 or more, and an average width of aggregated segregation existing in grain boundary phase of the silicon nitride sintered body is 2 μm or less.

3. A wear resistant member composed of silicon nitride sintered body containing 2–10 mass % of rare earth element in terms of oxide thereof as sintering agent, 1–2 mass % of magnesium oxide, 2–5 mass % of aluminum oxide, 1–7 mass % of silicon carbide, and 0.5–5 mass % of at least one element selected from the group consisting of Ti, Zr, Hf, W, Mo, Ta, Nb and Cr in terms of oxide thereof, wherein a porosity of said silicon nitride sintered body is 1 vol. % or less, a three-point bending strength is 900 MPa or more, and a fracture toughness is 6.3 MPa·m 1/2 or more, and a maximum width of aggregated segregation existing in grain boundary phase of the silicon nitride sintered body is 5 μm or less.

4. A wear resistant member composed of silicon nitride sintered body containing 2–10 mass % of rare earth element in terms of oxide thereof as sintering agent, 1–2 mass % of magnesium oxide, 2–5 mass % of aluminum oxide, 1–7 mass % of silicon carbide, and 0.5–5 mass % of at least one element selected from the group consisting of Ti, Zr, Hf, W, Mo, Ta, Nb and Cr in terms of oxide thereof, wherein a porosity of said silicon nitride sintered body is 1 vol. % or less, a three-point bending strength is 900 MPa or more, and a fracture toughness is 6.3 MPa·m 1/2 or more, and an average width of aggregated segregation existing in grain boundary phase of the silicon nitride sintered body is 2 μm or less.

5. A method of manufacturing a wear resistant member composed of silicon nitride sintered body comprising the steps of:

preparing a material mixture by adding 2–10 mass % of a rare earth element in terms of the amount of an oxide thereof, 2–7 mass % of MgAl 2 O 4 spinel, 1–7 mass % of silicon carbide, and 0.5–5 mass % of at least one element selected from the group consisting of Ti, Zr, Hf, W, Mo, Ta, Nb and Cr in terms of oxide thereof, to a silicon nitride powder containing 1.5 mass % or less of oxygen and 90 mass % or more of α-phase type silicon nitride and having an average grain size of 1 μm or less;

molding said material mixture to form a compact;

degreasing said compact; and

sintering the compact in non-oxidizing atmosphere at a temperature of 1,600° C. or lower thereby to form a wear resistant member composed of silicon nitride sintered body.

6. A method of manufacturing a wear resistant member composed of silicon nitride sintered body comprising the steps of:

preparing a material mixture by adding 2–10 mass % of a rare earth element in terms of the amount of an oxide thereof, 1–2 mass % of magnesium oxide, 2–5 mass % of aluminum oxide, 1–7 mass % of silicon carbide, and 0.5–5 mass % of at least one element selected from the group consisting of Ti, Zr, Hf, W, Mo, Ta, Nb and Cr in terms of oxide thereof, to a silicon nitride powder containing 1.5 mass % or less of oxygen and 90 mass % or more of α-phase type silicon nitride and having an average grain size of 1 μm or less;

molding said material mixture to form a compact;

degreasing said compact; and

sintering the compact in non-oxidizing atmosphere at a temperature of 1,600° C. or lower thereby to form a wear resistant member composed of silicon nitride sintered body.

7. The method of manufacturing the wear resistant member composed of silicon nitride sintered body according to claim 5 , wherein said method further comprising the step of: conducting a hot isostatic pressing (HIP) treatment to said silicon nitride sintered body in non-oxidizing atmosphere of 30 MPa or more at a temperature of 1,600° C. or lower after completion of the sintering step.

8. The method of manufacturing the wear resistant member composed of silicon nitride sintered body according to claim 6 , wherein said method further comprising the step of: conducting a hot isostatic pressing (HIP) treatment to said silicon nitride sintered body in non-oxidizing atmosphere of 30 MPa or more at a temperature of 1,600° C. or lower after completion of the sintering step.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2004
From: KOMATSU, MICHIYASU
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 015873/0602 →
Priority Claims (1)
JP 2001-223534 · Jul 24, 2001 · national
Continuity (1)
Related Publication 20040191535A1 · Sep 30, 2004