Semiconductor device and manufacturing method for the same
A semiconductor device and a manufacturing method for the same are provided wherein the reliability of connections of fine metal wires connecting a second semiconductor chip to a wiring board can be improved in the case wherein the second semiconductor chip, which is located above the lower, first semiconductor chip, is significantly larger than the first semiconductor chip in a configuration wherein two semiconductor chips are stacked and mounted on a wiring board. In this semiconductor device the rear surface of the first semiconductor chip and the rear surface of the second semiconductor chip are adhered to each other by means of adhesive and the side of the adhesive is inclined from the edge portions of the first semiconductor chip toward the portions of the second semiconductor chip extending from the side of the first semiconductor chip. Therefore, it becomes possible to prevent the occurrence of microcracks in the second semiconductor chip and to prevent the occurrence of defective fine metal wire connections caused by the impact at the time of electrical connection of the second semiconductor chip to the wiring board.
1. A semiconductor device comprising:
a wiring board having a first wiring electrode and a second wiring electrode;
a first semiconductor chip having, on the top surface, an electrode connected to said first wiring electrode; and
a second semiconductor chip, which is mounted on said first semiconductor chip, which is larger than the first semiconductor chip and which has, at least in the periphery of the top surface, an electrode electrically connected to said second wiring electrode by means of a fine metal wire, wherein:
the rear surface of said first semiconductor chip and the rear surface of said second semiconductor chip are adhered to each other by means of adhesive and the sides of said adhesive are inclined from the edge portions of said first semiconductor chip toward the portions of said second semiconductor chip extending from the sides of the first semiconductor chip,
a passive part is electrically connected to the same mounting surface on the wiring board that is connected to the first semiconductor chip,
the second semiconductor chin is larger than the region where the first semiconductor chip and said passive cart are placed, and
the rear surface of said second semiconductor chip and the rear surface of said passive cart facing the rear surface of said second semiconductor chip are adhered to each other.
2. The semiconductor device according to claim 1 , wherein the area of the cross section of the adhesive in a plane along the plane direction of the first semiconductor chip is no less than the area of the rear surface of said first semiconductor chip.
3. The semiconductor device according to claim 1 , wherein the surface of the side of the adhesive is in a concave, curved form.
4. The semiconductor device according to claim 1 , wherein the adhesive is formed over the entire region of the rear surface and over a portion of the sides of the first semiconductor chip.
5. The semiconductor device according to claim 1 , wherein an underfill resin is placed between the wiring board and the first semiconductor chip and wherein at least a portion of the side of said underfill resin is covered with an adhesive.
6. The semiconductor device according to claim 1 , wherein a spacer is adhered to the rear surface of said passive part so that the height of the spacer becomes approximately equal to the height of the rear surface of the first semiconductor chip and the rear surface of said second semiconductor chip and the rear surface of said passive part facing the rear surface of said second semiconductor chip are adhered to each other via the intervening spacer.