IC card and method of manufacturing the same
The invention provides an IC card in which it is difficult to separate IC chips from the IC card. In accordance with the invention, an IC card formed by laminating a plurality of substrates can include a sensor for identifying an authorized person, a signal processing circuit for processing the identification based on an output from the sensor and a card-shaped card medium containing the sensor and the signal processing circuit. At least the signal processing circuit can include a thin film circuit which is sufficiently thinner than the card medium and contains a material which is dissolvable equally to or more than the card medium.
1. An IC card, comprising:
a first substrate;
an IC circuit formed on the first substrate, the IC circuit processing an information, the IC circuit including a transistor, the transistor being bonded to the first substrate via an adhesion film; and
a second substrate, the second substrate and the first substrate sandwiching the IC circuit and a sensor element, a melting point of the IC circuit being lower than a melting point of at least one of the first substrate and the second substrate.
2. The IC card according to claim 1 , at least one of the first substrate and the second substrate including a resin material.
3. The IC card according to claim 1 , further comprising: the sensor element reading the information through a window portion, the second substrate having a window portion.
4. The IC card according to claim 1 , further comprising:
a display device being formed between the first substrate and the second substrate.
5. The IC card according to claim 1 , further comprising: a third substrate being formed between the first substrate and second substrate.
6. The IC card according to claim 1 , further comprising:
a third substrate, the first substrate being formed between the second substrate and the third substrate.
7. The IC card according to claim 1 , further comprising:
a third substrate, the second substrate being formed between the first substrate and the third substrate.