IP Library › Granted Patent US 709,040
Granted Patent S1
US 709,040 · App. 29/438,300 · Granted Jul 15, 2014

Light emitting diode package

Inventors: Shing-Kuo Chen (Taipei, TW); Pei-Song Cai (Miao Li County, TW); Bo-Yu Ko (New Taipei, TW); Chun-Wei Wang (New Taipei, TW)
Assignee: Lextar Electronics Corporation
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Quick Facts
Patent No.
US 709,040
App. No.
29/438,300
Granted
Jul 15, 2014
Kind
S1
Claims (1)

The ornamental design for a light emitting diode package, as shown and described.

Assignments (2)
MERGER Recorded Mar 27, 2026
From: LEXTAR ELECTRONICS CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075286/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2012
From: CHEN, SHING-KUO; CAI, PEI-SONG; KO, BO-YU; WANG, CHUN-WEI
To: LEXTAR ELECTRONICS CORP.
Reel/Frame 029367/0161 →
Priority Claims (1)
TW 101306654 · Nov 12, 2012 · national