IP Library Granted Patent US 7,120,345
Granted Patent B2
US 7,120,345 · App. 11/177,332 · Granted Oct 10, 2006

Process for producing flexible optical waveguide

Assignee: Nitto Denko Corporation
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Quick Facts
Patent No.
US 7,120,345
App. No.
11/177,332
Granted
Oct 10, 2006
Kind
B2
Abstract

The present invention provides a process for producing a flexible optical waveguide which comprises the steps of: immersing a substrate having an optical waveguide formed thereon in water to thereby reduce adhesion between the optical waveguide and the substrate and then peeling the optical waveguide from the substrate; temporarily bonding the peeled optical waveguide to a surface of a pressure-sensitive adhesive layer containing a foaming agent; cutting the temporarily bonded optical waveguide into a given length; allowing the foaming-agent-containing pressure-sensitive adhesive layer after the cutting step to foam by heating, thereby reducing adhesion between the foaming-agent-containing pressure-sensitive adhesive layer and the optical waveguide; and peeling the optical waveguide cut into the given length from the foamed adhesive layer.

Claims (19)

1. A process for producing a flexible optical waveguide which comprises the steps of:

immersing a substrate having an optical waveguide formed thereon in water to thereby reduce adhesion between the optical waveguide and the substrate and then peeling the optical waveguide from the substrate;

temporarily bonding the peeled optical waveguide to a surface of a pressure-sensitive adhesive layer containing a foaming agent;

cutting the temporarily bonded optical waveguide into a given length;

allowing the foaming-agent-containing pressure-sensitive adhesive layer after the cutting step to foam by heating, thereby reducing adhesion between the foaming-agent-containing pressure-sensitive adhesive layer and the optical waveguide; and

peeling the optical waveguide cut into the given length from the foamed adhesive layer.

2. The process for producing a flexible optical waveguide of claim 1 , wherein the substrate comprises at least one member selected from the group consisting of a silicon wafer, a silicon wafer coated with silicon dioxide, a blue plate glass, a synthetic quartz, and a polyimide resin.

3. The process for producing a flexible optical waveguide of claim 1 , wherein the optical waveguide formed on the substrate comprises at least:

an undercladding layer disposed on the substrate; and

a patterned core layer disposed on the undercladding layer.

4. The process for producing a flexible optical waveguide of claim 3 , wherein the undercladding layer comprises a fluorinated polyimide.

5. The process for producing a flexible optical waveguide of claim 3 , wherein the patterned core layer comprises a polyimide having a refractive index higher than that of the undercladding layer.

6. The process for producing a flexible optical waveguide of claim 3 , wherein the optical waveguide further comprises an overcladding layer disposed to surround the patterned core layer.

7. The process for producing a flexible optical waveguide of claim 6 , wherein the overcladding layer comprises a polyimide having a refractive index lower than that of the patterned core layer.

8. The process for producing a flexible optical waveguide of claim 1 , wherein the foaming agent contained in the pressure-sensitive adhesive layer is microencapsulated.

9. The process for producing a flexible optical waveguide of claim 1 , wherein the heating for allowing the foaming-agent-containing pressure-sensitive adhesive layer to foam is carried out at 100° C. to 150° C. for about 30 seconds to 1 minute.

10. The process for producing a flexible optical waveguide of claim 1 , wherein the foaming-agent-containing pressure-sensitive adhesive layer is supported by a support.

11. The process for producing a flexible optical waveguide of claim 10 , wherein the support comprises a polyester or a polypropylene.

12. The process for producing a flexible optical waveguide of claim 10 , wherein the support has a thickness of from 10 to 500 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2005
From: NAITOU, RYUUSUKE; MUNE, KAZUNORI; MOCHIZUKI, AMANE
To: NITTO DENKO CORPORATION
Reel/Frame 016740/0369 →
Priority Claims (1)
JP P.2004-204916 · Jul 12, 2004 · national
Continuity (1)
Related Publication 20060008225A1 · Jan 12, 2006