IP Library › Granted Patent US 713,020
Granted Patent S1
US 713,020 · App. 29/371,467 · Granted Sep 9, 2014

Heat pipe cooling device

Inventors: Hironori Kitajima (Tsuchiura, JP); Hitoshi Sakayori (Tsukuba, JP); Yuuzou Shiraishi (Tsuchiura, JP)
Assignee: Hitachi Power Solutions Co., Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 713,020
App. No.
29/371,467
Granted
Sep 9, 2014
Kind
S1
Claims (1)

The ornamental design for a heat pipe cooling device, substantially as shown and described.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2014
From: SH COPPER PRODUCTS CO., LTD.
To: HITACHI POWER SOLUTIONS CO., LTD.
Reel/Frame 032309/0426 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2013
From: HITACHI CABLE, LTD.
To: SH COPPER PRODUCTS CO., LTD.
Reel/Frame 030716/0615 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2011
From: KITAJIMA, HIRONORI; SAKAYORI, HITOSHI; SHIRAISHI, YUUZOU
To: HITACHI CABLE, LTD.
Reel/Frame 025966/0270 →
Priority Claims (3)
JP 2010-021910 · Sep 10, 2010 · national
JP 2010-027000 · Nov 10, 2010 · national
JP 2010-031223 · Dec 28, 2010 · national