IP Library Granted Patent US 7,218,524
Granted Patent B2
US 7,218,524 · App. 10/954,316 · Granted May 15, 2007

Locking device for heat dissipating device

Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd.
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Quick Facts
Patent No.
US 7,218,524
App. No.
10/954,316
Granted
May 15, 2007
Kind
B2
Abstract

A locking device for mounting a heat dissipating device to a CPU mounted on a printed circuit board, includes a back plate mounted below the circuit board and a retainer. The back plate includes a plurality of posts extending upwardly through the circuit board and engaging with screws thereat. The retainer includes a mounting section attached to the heat dissipating device and a plurality of spring locking sections extending radially from the mounting section. The locking sections are downwardly pressable to engage with the respective posts and screws whereby the retainer mounts the heat dissipating device to the electronic component.

Claims (32)

1. An assembly comprising:

a circuit board on which an electronic component and a plurality of fasteners surrounding the electronic component are provided;

a heat dissipating device placed on the electronic component; and

a retainer attached to the heat dissipating device and comprising a plurality of locking sections elastically deformed to engage with the fasteners respectively;

wherein the fasteners are adjustable to adjust the deformation of the locking sections to thereby provide an adjustable contact force between the heat dissipating device and the electronic component;

wherein the retainer is made of a wire.

2. The assembly as claimed in claim 1 , wherein each of the fasteners comprises a post and a screw screwed to the post.

3. The assembly as claimed in claim 2 , wherein each of the locking sections comprises a hook formed at a free end thereof and engaged between the post and the screw of a corresponding fastener.

4. The assembly as claimed in claim 3 , wherein each hook has a semicircular shape and the hooks of every two adjacent locking sections are mirror image with each other about a bisector between said two adjacent locking sections.

5. The assembly as claimed in claim 2 further comprising a back plate mounted below the circuit board, the posts extending upwardly from the back plate beyond the circuit board.

6. The assembly as claimed in claim 1 , wherein the heat dissipating device comprises a base and the retainer comprises a circular mounting section attachably surrounding the base.

7. The assembly as claimed in claim 6 , wherein the heat dissipating device comprises a column-shaped heat sink and a fan mounted on the heat sink.

8. A combination comprising:

a circuit board on which an electronic component and a plurality of posts surrounding the electronic component are provided;

a heat dissipating device placed on the electronic component; and

a retainer comprising a mounting section attached to the heat dissipating device and a plurality of elastic locking sections extending radially from the mounting section, each of the locking sections comprising a hook formed at a free end thereof;

wherein the hooks of the locking sections are pressable to engage with the posts respectively whereby the retainer mounts the heat dissipating device to the electronic component.

9. The combination as claimed in claim 8 , wherein each of the posts is provided with a screw screwed thereon and each of the locking sections is engagable with a corresponding post between said post and the screw.

10. The combination as claimed in claim 9 , wherein the inserting position of the screw into said post is adjustable to adjust the deformation of the locking sections to thereby provide adjustable contact force between the heat dissipating device and the electronic component.

11. The combination as claimed in claim 10 , wherein each hook engages between the post and the screw.

12. The combination as claimed in claim 11 , wherein the hook is semicircular-shaped and the hooks of every two adjacent locking sections are mirror image with each other about a bisector between said two adjacent locking sections.

13. The combination as claimed in claim 10 further comprising a back plate mounted below the circuit board, the posts extending upwardly from the back plate beyond the circuit board.

14. The combination as claimed in claim 8 , wherein the retainer is securely attached to the heat dissipating device prior to the locking sections being pressed to engage with the posts respectively.

15. The combination as claimed in claim 9 , wherein the screws are screwed into the posts prior to the locking sections being pressed to engage with the posts respectively.

16. The combination as claimed in claim 8 , wherein the heat dissipating device comprises a cone base and the retainer comprises a circular mounting section attachably surrounding the base.

17. The combination as claimed in claim 16 , wherein a through hole is defined in the cone base in a longitudinal direction thereof, and the heat dissipating device further comprises a core received in the through hole of the cone base.

18. A locking device for mounting a heat dissipating device onto a heat generating component, comprising:

a plurality of fasteners having locations of surrounding said heat generating component, each of said fasteners defining at least two engagable extensions; and

a retainer attached to said heat dissipating device and having a plurality of locking sections corresponding respectively to said fasteners, each of said locking sections being engagable with one of said at least two extensions of each of said fasteners so as to provide at least two kinds of pressured contacting between said heat dissipating device and said heat generating component;

wherein the fasteners are adapted to be securely positioned in the vicinity of said heat generating component prior to said locking sections of the retainer engaging with said fasteners, respectively.

19. The locking device as claimed in claim 18 , further comprising a back plate mounted beside said heat generating component opposing to said heat dissipating device, said back plate including posts extending to surround said heat generating component in order to form portions of said fasteners.

20. The locking device as claimed in claim 19 , further comprising screws as the other portions of said fasteners, said at least two extensions of said fasteners being formed respectively by means of varying insertion of said screws into said posts of said back plate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 27, 2007
From: HON HAI PRECISION INDUSTRY CO., LTD
To: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.; FOXCONN TECHNOLOGY CO., LTD.
Reel/Frame 019068/0169 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2004
From: YU, GUANG; LEE, TSUNG-LUNG
To: HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 015865/0841 →
Continuity (1)
Related Publication 20060067053A1 · Mar 30, 2006