IP Library Granted Patent US 722,573
Granted Patent S1
US 722,573 · App. 29/473,920 · Granted Feb 17, 2015

U-shaped condenser heat sink for low profile modules

Inventors: Ali Mira (Morgan Hill, CA); Yashar Mira (Morgan Hill, CA); Michael Mira (Morgan Hill, CA)
Assignee: Heatscape, Inc.
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Quick Facts
Patent No.
US 722,573
App. No.
29/473,920
Granted
Feb 17, 2015
Kind
S1
Claims (1)

The ornamental design for a U-shaped condenser heat sink for low profile modules, as shown and described.

Assignments (3)
SECURITY INTEREST Recorded Oct 31, 2025
From: HEATSCAPE, LLC
To: EAST WEST BANK
Reel/Frame 072753/0269 →
CHANGE OF NAME Recorded Oct 30, 2025
From: HEATSCAPE.COM, INC.
To: HEATSCAPE, LLC
Reel/Frame 073418/0478 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2013
From: MIRA, ALI; MIRA, MICHAEL; MIRA, YASHAR
To: HEATSCAPE, INC.
Reel/Frame 031683/0116 →