Smart card and method for manufacturing a smart card
View Patent ↗A smart card and a method for manufacturing the same wherein the smart card is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board, a filler board, attached to the top surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a thermosetting polymeric layer positioned between the top surface of the printed circuit board and the top overlay.
1. A method for manufacturing a smart card, comprising:
providing a printed circuit board having a top surface and a bottom surface, with circuit traces on the top surface of the printed circuit board;
attaching filler board having a plurality of openings to the top surface of the printed circuit board;
inserting a plurality of circuit components into the plurality of filler board openings;
attaching the bottom surface of the printed circuit board to a bottom overlay;
loading the printed circuit board and bottom overlay into an injection molding apparatus;
loading a top overlay positioned above a top surface of the filler board into the injection molding apparatus; and
injecting thermosetting polymeric material between the top surface of the filler board, the plurality of circuit components and the bottom overlay.
2. The method of claim 1 , wherein a plurality of smart cards are formed on one printed circuit board.
3. The method of claim 2 , further comprising: removing the injected top and bottom overlay from the mould; and cutting out the plurality smart cards.
4. The method of claim 1 , wherein the circuit traces are formed by etching traces into the printed circuit board.
5. The method of claim 1 wherein the inserting step further comprises connecting each of the plurality of circuit components to the top surface of the printed circuit board.