IP Library Granted Patent US 7,240,722
Granted Patent B2
US 7,240,722 · App. 11/164,282 · Granted Jul 10, 2007

Heat dissipation device

Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd.
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Quick Facts
Patent No.
US 7,240,722
App. No.
11/164,282
Granted
Jul 10, 2007
Kind
B2
Abstract

A heat dissipation device includes a liquid cooling system and a heat exchanger. The liquid cooling system includes a cold plate ( 20 ) having an inlet ( 244 ) and an outlet ( 246 ) to permit liquid to flow through the cold plate. The heat exchanger includes a heat conductive member ( 10 ) thermally connecting with the cold plate to fins ( 60 ).

Claims (11)

1. A heat dissipation device comprising:

a liquid cooling system comprising a cold plate, the cold plate comprising an inlet and an outlet to permit liquid to flow through the cold plate, and a groove defined in a bottom side of the cold plate, wherein the cold plate comprises a base and a cover hermetically mounted on one side of the base and wherein the groove is defined in another side of the base opposite to the cover; and

a heat exchanger comprising a heat conductive member with a part thereof accommodated in the groove of the cold plate;

wherein the cover comprises a protrusion extending from a central portion thereof toward a direction away from the base, wherein a cavity is defined in the protrusion to form a liquid container when the cover and the base are assembled together to form the cold plate; and

wherein the inlet is disposed in a central portion of the protrusion of the cover, and the inlet extends along a direction away from the protrusion of the cover perpendicular to the base of the cold plate.

2. The heat dissipation device as claimed in claim 1 , wherein the heat exchanger further comprises a plurality of fins, the heat conductive member thermally connecting the cold plate and the fins together.

3. The heat dissipation device as claimed in claim 1 , wherein the heat conductive member comprises a heat pipe, and the heat pipe comprises an evaporator accommodated in the groove and a condenser extending from the evaporator.

4. The heat dissipation device as claimed in claim 3 , wherein the condenser of the heat pipe is substantially perpendicular to the base and is transverse to and in fixed contact with the fins.

5. The heat dissipation device as claimed in claim 1 , wherein the inlet and the outlet are defined in the protrusion.

6. The heat dissipation device as claimed in claim 1 , wherein the heat conductive member comprises a heat pipe, and the heat pipe comprises an evaporator accommodated in the groove and a condenser extending from the evaporator extending along a direction parallel to the inlet.

7. The heat dissipation device as claimed in claim 6 , wherein the liquid flowing into the cold plate via the inlet directly impinges on a central portion of the base.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2007
From: FOXCONN TECHNOLOGY CO.,LTD.
To: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.; FOXCONN TECHNOLOGY CO.,LTD.
Reel/Frame 019247/0370 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2005
From: LAI, CHENG-TIEN; ZHOU, ZHI-YONG; WEN, JIANG-JIAN
To: FOXCONN TECHNOLOGY CO.,LTD.
Reel/Frame 016789/0941 →
Priority Claims (1)
CN 2005 1 0035227 · Jun 8, 2005 · national
Continuity (1)
Related Publication 20060278372A1 · Dec 14, 2006