Embedded capacitor
An embedded capacitor comprises a first substrate on which a plurality of electrically insulated electrode patterns and a ground pattern are formed, a second substrate separated from the first substrate, a plurality of dielectric layers stacked between the first and second substrates, a plurality of metal layers inserted between the dielectric layers and connected to the electrode patterns of the first substrate, and a plurality of ground layers inserted between the dielectric layers alternately with the metal layers.
1. An embedded capacitor comprising:
a first substrate on which a plurality of electrically insulated electrode patterns and a ground pattern are formed;
a second substrate;
a plurality of dielectric layers stacked between the first and second substrates;
a plurality of metal layers inserted between the plurality of-dielectric layers and coupled to the electrode patterns of the first substrate; and
a plurality of ground layers inserted between the dielectric layers and the metal layers in sequence, wherein each of the first and second substrates comprises a copper foil.
2. The embedded capacitor according to claim 1 , wherein each of the electrode patterns formed on the first substrate is electrically coupled to the corresponding metal layer.
3. The embedded capacitor according to claim 1 , wherein the ground pattern formed on the first substrate is electrically coupled to the ground layers.
4. The embedded capacitor according to claim 1 , wherein the thickness of the plurality of dielectric layers ranges between 10 to 15 μm.