IP Library Granted Patent US 7,303,530
Granted Patent B2
US 7,303,530 · App. 10/443,257 · Granted Dec 4, 2007

Transducer arrays with an integrated sensor and methods of use

Assignee: Siemens Medical Solutions USA, Inc.
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Quick Facts
Patent No.
US 7,303,530
App. No.
10/443,257
Granted
Dec 4, 2007
Kind
B2
Abstract

Methods and systems for obtaining ultrasound and sensing other patient characteristics are provided from summary. One or more sensors are provided in a same transducer probe as an array of elements. For example, sensors are formed on a same semiconductor substrate, such as a silicon substrate, as microelectromechanical devices or a capacitive membrane ultrasonic transducer (CMUT). As another example, a sensor is provided separate from or attached to transducer materials. Possible sensors include temperature, pressure, microphone, chemical and/or other sensors.

Claims (13)

1. A transducer probe for ultrasound detection, the transducer probe comprising:

a probe housing;

an imaging array of transducer elements connected with the probe housing, the transducer elements being on or within a substrate; and

a temperature sensor integrated on or within the substrate.

2. The probe of claim 1 wherein the transducer elements comprise a capacitive membrane ultrasonic transducer and the substrate comprises a semiconductor substrate.

3. The probe of claim 2 wherein the temperature sensor comprises a microelectromechanical device formed on the semiconductor substrate.

4. The probe of claim 2 wherein the temperature sensor comprises at least in part an integrated circuit component on the semiconductor substrate.

5. The probe of claim 1 wherein the temperature sensor is integrated between at least two of the transducer elements.

6. The probe of claim 1 wherein the temperature sensor is positioned to measure a temperature of the probe housing.

7. The probe of claim 1 wherein the temperature sensor is positioned to measure a temperature of a subject being examined.

8. The probe of claim 1 wherein the temperature sensor integrated on or within the substrate comprises the temperature sensor formed on or within the substrate.

9. The probe of claim 8 wherein the temperature sensor is formed on the substrate.

10. The probe of claim 8 wherein the temperature sensor is formed within the substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2004
From: BARNES, STEPHEN R.; BOLORFOROSH, MIRSAID; BANJANIN,ZORAN
To: SIEMENS MEDICAL SOLUTIONS USA, INC.
Reel/Frame 015553/0033 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2003
From: BARNES, STEPHEN R.; BOLORFOROSH, MIRSAID; BANJANIN, ZORAN
To: SIEMENS MEDICAL SOLUTIONS USA, INC.
Reel/Frame 014105/0671 →
Continuity (1)
Related Publication 20040236223A1 · Nov 25, 2004