Epoxy compound, preparation method thereof, and use thereof
The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property and which can provide a cured product which is excellent in mechanical strength, heat resistance, and moisture resistance. It also relates to a preparation method of the epoxy compound, an epoxy resin composition, and a cured product thereof. The epoxy compound is represented by the following general formula (I): (wherein R 1 -R 10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more).
1. An epoxy compound having a following general formula (I): General formula (I)
wherein R 1 -R 10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more.
2. An epoxy compound as claimed in claim 1 , wherein R 1 -R 10 are hydrogen atoms or R 3 , R 4 are methyl groups while R 1 , R 2 , R 5 -R 10 are hydrogen atoms.
3. A curable epoxy resin composition containing:
an epoxy resin having two or more epoxy groups per molecule; a curing agent; and a curing accelerator, wherein the epoxy resin contains 5-100% by mass of an epoxy compound as claimed in claim 1 .
4. A cured product made by curing a curable epoxy resin composition as claimed in claim 3 .
5. An epoxy resin composition for semiconductor encapsulation comprising: an epoxy resin containing 5-100% by mass of an epoxy compound as claimed in claim 1 ; a phenolic curing agent having two or more phenolic hydroxyl groups per molecule; an inorganic filler; and a curing accelerator.
6. An epoxy resin composition for semiconductor encapsulation as claimed in claim 5 , wherein the phenolic curing agent is at least one phenol resin selected from a group consisting of phenol novolak resin, phenol aralkyl resin, naphthol novolak resin, and naphthol aralkyl resin.
7. An epoxy resin composition for semiconductor encapsulation as claimed in claim 5 , wherein fused and/or crystalline silica powder filler having pulverized form and/or spherical form is contained as the inorganic filler in an amount of 60-95% by mass of the whole composition.
8. An epoxy resin composition for semiconductor encapsulation as claimed in claim 5 , wherein the composition does not contain halogen compound and/or antimony compound as a flame retardant component and a cured product made from the composition has flame retardance that meets V-0 of UL-94 standard.
9. A semiconductor device of which semiconductor elements and/or semiconductor integrated circuits are encapsulated with cured product of an epoxy resin composition for semiconductor encapsulation as claimed in claim 5 .
10. An epoxy compound as claimed in claim 1 , wherein n represents an integer of 1 or more.
11. An epoxy compound as claimed in claim 10 , wherein R 3 , R 4 are methyl groups while R 1 , R 2 , R 5 -R 10 are hydrogen atoms.