Sensor device
A sensor device includes a sensor chip having a movable portion on one surface, a circuit chip laminated with the sensor chip to be opposite to the movable portion of the sensor chip, and a bump located between the sensor chip and the circuit chip. In the sensor device, the sensor chip and the circuit chip are electrically connected through the bump, and the movable portion of the sensor chip is separated from the circuit chip by a space using the bump. Accordingly, it can effectively restrict parasitic capacity of an electric connecting portion between both the chips from being changed by an impact. For example, the sensor device can be used as an angular velocity sensor device having a vibrator as the movable portion.
1. A sensor device comprising:
a sensor chip having a movable portion on one surface;
a circuit chip laminated with the sensor chip to be opposite to the movable portion of the sensor chip;
an adhesive member having an electric insulating property, the adhesive member being arranged between the sensor chip and the circuit chip for bonding both the sensor chip and the circuit chip, and the adhesive member being separated from the movable portion of the sensor chip and being constructed with an adhesive film, the adhesive film having a first portion opposite to the movable portion and a second portion positioned outside from the first portion, and the first portion of the adhesive film being made thinner than the second portion of the adhesive film to form a concave portion recessed from a surface on a side of the movable portion; and
a bump located between the sensor chip and the circuit chip,
wherein the sensor chip and the circuit chip are electrically connected through the bump, and the movable portion of the sensor chip is separated from the circuit chip by a space using the bump.
2. The sensor device according to claim 1 , wherein the adhesive member is arranged around the bump and seals the bump.
3. The sensor device according to claim 1 , wherein:
the adhesive member is arranged to surround the movable portion between the sensor chip and the circuit chip; and
the movable portion positioned at an inner peripheral side of the adhesive member is sealed by the adhesive member.
4. The sensor device according to claim 1 , wherein the adhesive film is formed by a printing.
5. The sensor device according to claim 1 , wherein the adhesive member is provided to form a seal portion for sealing the movable portion around the movable portion, the sensor device further comprising a coating member which covers the seal portion.
6. The sensor device according to claim 1 , wherein the bump includes a plurality of bump parts which are arranged in point-symmetry with respect to a center of the sensor chip.
7. The sensor device according to claim 1 , wherein the bump includes a plurality of bump parts which are separately arranged around the movable portion.
8. The sensor device according to claim 7 , wherein:
the adhesive member is arranged around the movable portion of the sensor chip.
9. The sensor device according to claim 8 , wherein the bump parts are located in an area where the adhesive member is arranged.
10. The sensor device according to claim 8 , wherein the adhesive member is located outside of the bump parts to surround the bump parts.
11. The sensor device according to claim 8 , wherein:
the adhesive member includes a plurality of adhesive parts which are arranged around the movable portion; and
the adhesive parts are arranged to surround the bump parts, respectively.
12. The sensor device according to claim 8 , wherein:
the adhesive member includes a plurality of adhesive parts which are arranged around the movable portion; and
the adhesive parts are arranged at positions different from the bump parts, respectively.
13. The sensor device according to claim 1 , further comprising
a package having a space in which the circuit chip and the sensor chip are located; and
an additional bump through which the circuit chip is electrically connected to an electrical portion of the package.
14. A sensor device comprising:
a sensor chip having a movable portion on one surface;
a circuit chip laminated with the sensor chip to be opposite to the movable portion of the sensor chip;
an adhesive member having an electric insulating property, the adhesive member being arranged between the sensor chip and the circuit chip for bonding both the sensor chip and the circuit chip, and the adhesive member being separated from the movable portion of the sensor chip and being constructed with an adhesive film, the adhesive film having a convex portion protruding in a direction separating from the movable portion; and
a bump located between the sensor chip and the circuit chip,
wherein the sensor chip and the circuit chip are electrically connected through the bump, and the movable portion of the sensor chip is separated from the circuit chip by a space using the bump.
15. The sensor device according to claim 14 , wherein the adhesive member is arranged around the bump and seals the bump.
16. The sensor device according to claim 14 , wherein:
the adhesive member is arranged to surround the movable portion between the sensor chip and the circuit chip; and
the movable portion positioned at an inner peripheral side of the adhesive member is sealed by the adhesive member.
17. The sensor device according to claim 14 , wherein the adhesive film is formed by a printing.
18. The sensor device according to claim 14 , wherein the adhesive member is provided to form a seal portion for sealing the movable portion around the movable portion, the sensor device further comprising a coating member which covers the seal portion.
19. The sensor device according to claim 14 , wherein the bump includes a plurality of bump parts which are arranged in point-symmetry with respect to a center of the sensor chip.
20. The sensor device according to claim 14 , wherein the bump includes a plurality of bump parts which are separately arranged around the movable portion.