IP Library Granted Patent US 7,332,432
Granted Patent B2
US 7,332,432 · App. 10/946,649 · Granted Feb 19, 2008

Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same

Assignee: Semiconductor Energy Laboratory Co., Ltd.
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Quick Facts
Patent No.
US 7,332,432
App. No.
10/946,649
Granted
Feb 19, 2008
Kind
B2
Abstract

As a semiconductor device, specifically, a pixel portion included in a semiconductor device is made to have higher precision and higher aperture ratio, it is required to form a smaller wiring in width. In the case of forming a wiring by using an ink-jet method, a dot spreads on a wiring formation surface, and it is difficult to narrow width of a wiring. In the present invention, a photocatalytic substance typified by TiO 2 is formed on a wiring formation surface, and a wiring is formed by utilizing photocatalytic activity of the photocatalytic substance. According to the present invention, a narrower wiring, that is, a smaller wiring in width than a diameter of a dot formed by an ink-jet method can be formed.

Claims (14)

1. A method for manufacturing a thin film transistor comprising:

forming a substance having a photocatalytic function over an insulating surface;

selectively irradiating the substance with light to be hydrophilic;

discharging a conductive material mixed with a water-based solvent to a region irradiated with the light by an ink-jet method to form a wiring;

forming a semiconductor film over the wiring;

forming a gate insulating film comprising a substance having a photocatalytic function to cover the semiconductor film;

selectively irradiating the gate insulating film with light to be hydrophilic; and

discharging a conductive material mixed into a water-based solvent to a region irradiated with the light by an ink-jet method to form a gate electrode.

2. A method for manufacturing a thin film transistor according to any one of claim 1 , further comprising the steps of:

forming an electrode connected to the wiring; and

forming a protective film by an ink-jet method to cover the semiconductor film, the gate electrode, and a part of the electrode.

3. A method for manufacturing a thin film transistor according to claim 1 , further comprising the steps of forming an electroluminescent layer and an electrode over the electroluminescent layer.

4. A method for manufacturing a thin film transistor according to claim 1 , further comprising the steps forming an orientation film, dropping a liquid crystal over the orientation film, and attaching an opposing substrate provided with an electrode, a color filter, and an orientation film.

5. A method for manufacturing a thin film transistor according to claim 1 , wherein the thin film transistor is incorporated in at least one selected from the group consisting of a video camera, a digital camera, a goggle type display, a navigation system, an audio reproducing device, a personal computer, a game machine, a personal digital assistance, and an image reproducing device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2005
From: NAKAMURA, OSAMU; OGINO, KIYOFUMI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 016136/0439 →
Priority Claims (1)
JP 2003-344202 · Oct 2, 2003 · national
Continuity (1)
Related Publication 20050095356A1 · May 5, 2005