Integral heat-dissipation system for electronic boards
A system of at least one integrated electronic board device with integral cooling system. The device comprises an integrated electronic board, with a plurality of heat-dissipating electronic components distributed over it, with heat-exchanging devices coupled to the heat-dissipating electronic components, and a plurality of slots provided adjacent each of the plurality of heat-dissipating electronic components. Each slot fluidically communicates with a heat-exchanging device. An adjoining cover defining, with the integrated electronic board, a cavity for providing an integral reservoir between the slots and at least one port that may be connected to a flow generator for generating a flow of a fluidic coolant through said at least one of a plurality of heat-exchanging devices.
1. An integrated electronic board system with integral cooling facility, the system comprising:
at least one integrated electronic board, with a plurality of heat-dissipating electronic components distributed over it, each of the heat dissipating components coupled to a respective one of a plurality of heat-exchanging devices, and one or more slots provided adjacent each of said plurality of heat-dissipating electronic components, each of said one or more slots fluidically communicating with at least one respective heat-exchanging device of said plurality of heat-exchanging devices; and
an adjoining cover defining, with said at least one integrated electronic board, a cavity for providing an integral reservoir between said one or more slots and at least one port for connecting to a flow generator for generating a flow of a fluidic coolant through the heat-exchanging device that is coupled to each of said one or more heat dissipating devices.
2. The system of claim 1 , wherein the flow generator is a vacuum source that maintains in the cavity pressure that is lower than ambient pressure.
3. The system of claim 1 , wherein the flow generator is a pressurized air source that maintains in the cavity pressure above ambient pressure.
4. The system of claim 1 , wherein the adjoining cover is an integrated electronic board.
5. The system of claim 1 , wherein said at least one integrated electronic board comprises more than one integrated electronic board, and wherein the flow generator is connected to port of each cavity of a plurality of cavities respective to said more than one integrated electronic board.
6. The system of claim 5 , wherein the port of each cavity is connected via a shared manifold to the flow generator.
7. The system of claim 1 , wherein the heat-exchanging device comprises a heat-conductive body provided with conduits through the body, fluidically communicating with at least one of said one or more slots.
8. The system of claim 7 , wherein the conduits are communicating through a manifold with said at least one of said one or more slots.
9. The system of claim 1 , wherein at least some of the heat-dissipating electronic components are coupled to the same heat exchanging device.
10. The system of claim 1 , wherein at least some of the heat-dissipating electronic components share a single slot of said one or more slots.
11. The system of claim 1 , wherein said at least one port is provided on a side wall.
12. The system of claim 1 , wherein said at least one port is provided perpendicular to said at least one integrated electronic board.
13. The system of claim 1 , wherein more than one of said one or more slots are provided adjacent each of the heat-dissipating electronic components, said more than one slot communicating with the heat-exchanging device coupled to the respective heat-dissipating electronic component.
14. The system of claim 13 , wherein more than one of said one or more slots are provided on more than one side of each of the heat-dissipating electronic components.
15. A method of cooling heat-dissipating electronic devices, the method comprising:
providing a system comprising at least one integrated electronic board, with a plurality of heat-dissipating electronic components distributed over it, each of the heat dissipating components coupled to a respective one of a plurality of heat-exchanging devices, and one or more slots provided adjacent each of said plurality of heat-dissipating electronic components, each of said one or more slots fluidically communicating with at least one respective heat-exchanging device of said plurality of heat-exchanging devices;
providing an adjoining cover defining, with said at least one integrated electronic board, a cavity for providing an integral reservoir between said one or more slots and at least one port for connecting to a flow generator for generating a flow of a fluidic coolant through the heat-exchanging device that is coupled to each of said one or more heat dissipating devices; and
using the flow generator to drive a fluidic coolant through the heat-exchanging device that is coupled to each of said one or more heat dissipating devices.
16. The method of claim 15 , wherein the flow generator is a vacuum source that maintains in the cavity pressure that is lower than ambient pressure.
17. The method of claim 15 , wherein the fluidic coolant is air.
18. The method of claim 15 , wherein the adjoining cover is an integrated electronic board.
19. The method of claim 15 , wherein said at least one integrated electronic board comprises more than one integrated electronic board, and wherein the flow generator is connected to the port of each cavity of a plurality of cavities respective to said more than one integrated electronic board.
20. The method of claim 19 , wherein the port of each cavity is connected via a shared manifold to the flow generator.
21. The method of claim 15 , wherein the heat-exchanging device comprises a heat-conductive body provided with conduits through the body, fluidically communicating with at least one of said one or more slots.
22. The method of claim 21 , wherein the conduits are communicating through a manifold with said at least one of said one or more slots.
23. The method of claim 15 , wherein at least some of the heat-dissipating electronic components are coupled to the same heat exchanging device.
24. The method of claim 15 , wherein at least some of the heat-dissipating electronic components share a single slot of said one or more slots.
25. The method of claim 15 , wherein said at least one port is provided on a side wall.
26. The method of claim 15 , wherein said at least one port is provided perpendicular to said at least one integrated electronic board.
27. The method of claim 15 , wherein more than one slot are provided adjacent a heat-dissipating electronic component of said heat-dissipating electronic components, all of which are communicating with the heat-exchanging device coupled to the respective heat-dissipating electronic component.
28. The method of claim 27 , wherein said more than one of said one or more slots are provided on more than one side of the heat-dissipating electronic component.