Semiconductor device and method of manufacturing semiconductor device
The present invention provides a semiconductor device that is inexpensive and can suppress signal transmission delay, and a manufacturing method thereof. The semiconductor device includes: a plurality of semiconductor chips; a semiconductor substrate that has, on the same surface thereof, a chip-to-chip interconnection for electrically connecting the plurality of semiconductor chips to each other, and a plurality of chip-connection pads connected to the chip-to-chip interconnection; and a wiring board that has a plurality of lands of which pitch is larger than a pitch of the chip-connection pads, wherein a major surface of each of the plurality of semiconductor chips is connected to the chip-connection pads via a first connector so that the plurality of semiconductor chips are mounted on the semiconductor substrate, and an external-connection pad is formed on the major surface other than a region facing the semiconductor substrate, and is connected to the land on the wiring board via a second connector.
1. A semiconductor device comprising:
a plurality of semiconductor chips adjacent to one another;
a semiconductor substrate that has, on the same surface thereof, a chip-to-chip interconnection for electrically connecting the plurality of adjacent semiconductor chips to each other, and a plurality of chip-connection pads connected to the chip-to-chip interconnection; and
a wiring board that has a plurality of lands of which pitch is larger than a pitch of the chip-connection pads, wherein
a major surface of each of the plurality of semiconductor chips is connected to the chip-connection pads via a first connector so that the plurality of semiconductor chips are mounted on the semiconductor substrate, and
an external-connection pad is formed on the major surface other than a region facing the semiconductor substrate, and is connected to the land on the wiring board via a second connector.
2. The semiconductor device according to claim 1 , wherein
the semiconductor substrate is located in a hollow formed in the wiring board.
3. The semiconductor device according to claim 2 , wherein
a resin material is provided in the hollow in a manner of surrounding the semiconductor substrate, and the semiconductor substrate is bonded to the wiring board via the resin material.
4. A semiconductor device comprising:
a plurality of semiconductor chips adjacent to one another; and
a semiconductor substrate that has, on the same surface thereof, a chip-to-chip interconnection for electrically connecting the plurality of adjacent semiconductor chips to each other, and a plurality of chip-connection pads connected to the chip-to-chip interconnection, wherein
a major surface of each of the plurality of semiconductor chips is connected to the chip-connection pads via a connector so that the plurality of semiconductor chips are mounted on the semiconductor substrate, and
a plurality of external-connection pads are formed on the major surface other than a region facing the semiconductor substrate, the external-connection pads having a pitch larger than a pitch of the chip-connection pads.