IP Library Granted Patent US 7,413,482
Granted Patent B2
US 7,413,482 · App. 11/281,008 · Granted Aug 19, 2008

Method for forming a connector assembly for use with an implantable medical device

Assignee: Medtronic, Inc.
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Quick Facts
Patent No.
US 7,413,482
App. No.
11/281,008
Granted
Aug 19, 2008
Kind
B2
Abstract

A sectional interconnect ribbon for use in a connector assembly for an implantable medical device is formed of two ore more separately-formed sections which are mechanically joined together to form an integral assembly. The sectional interconnect ribbon, as well as at least one connection element, is embedded within the connector assembly.

Claims (25)

1. A method for fabricating a connector assembly for use in an implantable medical device, the method comprising:

forming a core portion;

loading the core portion with at least one connection element;

forming a first interconnect ribbon section comprising at least one conductive finger element and a tie-bar portion, each finger element having a free end for attachment to one of the electrical connector elements and a fixed end attached to the tie-bar portion;

forming a second interconnect ribbon section comprising at least one conductive finger element and a tie-bar portion, each finger element having a free end for attachment to one of the electrical connector elements and a fixed end attached to the tie-bar portion;

joining the first and second interconnect ribbon sections into an integral interconnect ribbon assembly;

attaching the integral interconnect ribbon assembly to the core portion and the at least one connection element; and

forming a structure that extends over and adheres to at least a portion of the core element and at least a portion of the integral interconnect ribbon assembly.

2. The method of claim 1 and further comprising:

removing the tie-bar portion of the integral interconnect ribbon assembly such that each of the finger elements of the integral interconnect ribbon is mechanically and electrically separated from one another.

3. The method of claim 1 , wherein forming the first interconnect ribbon section comprises:

stamping the first interconnect ribbon section from a substantially planar sheet of conductive material.

4. The method of claim 3 , wherein forming the second interconnect ribbon section comprises:

stamping the second interconnect ribbon section from a substantially planar sheet of conductive material.

5. The method of claim 1 , wherein at least one of the conductive finger elements of the first interconnect ribbon section when laid flat overlaps at least one of the conductive finger elements of the second interconnect ribbon section when laid flat.

6. The method of claim 1 , wherein the fixed ends of the first and second interconnect ribbon sections have generally planar profiles that reside in substantially the same plane.

7. The method of claim 1 , wherein mechanically joining the first and second interconnect ribbon sections into an integral interconnect ribbon assembly comprises:

lap welding the tie-bar portion of the first interconnect ribbon section to the tie-bar portion of the second interconnect ribbon section.

8. The method of claim 1 , wherein mechanically joining the first and second interconnect ribbon sections into an integral interconnect ribbon assembly comprises:

attaching a supplemental tie-bar to the tie-bar portions of the first and second interconnect ribbon sections.

9. A connector assembly for use in an implantable medical device, the connector assembly being fabricated by the method of claim 2 .

10. The connector assembly of claim 9 , wherein at least one of the conductive finger elements of the first interconnect ribbon section when laid flat overlaps at least one of the conductive finger elements of the second interconnect ribbon section when laid flat.

11. The connector assembly of claim 9 , wherein the fixed ends of the first and second interconnect ribbon sections have generally planar profiles that reside in substantially the same plane.

12. The connector assembly of claim 9 , wherein the tie-bar portions of the first and second interconnect ribbon sections are joined together via a lap weld joint.

13. The connector assembly of claim 9 , wherein the tie-bar portions of the first and second interconnect ribbon sections are joined together via a supplemental tie-bar portion attached to the tie-bar portions of the first and second interconnect ribbon sections.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2008
From: RIES, ANDREW J.; LAHTI, JAY K.; PATRAS, GEORGE; LONGTIN, JOHN D.; ZART, BRYAN J.
To: MEDTRONIC, INC.
Reel/Frame 021202/0326 →
Continuity (1)
Related Publication 20070111587A1 · May 17, 2007