Micromechanical component having an anodically bonded cap and a manufacturing method
A micromechanical component includes a cap wafer made up of at least a first silicon substrate and a thin glass substrate, and having a functional wafer made up of at least a second silicon substrate, at least one electrical contact surface being disposed on the functional wafer. the cap wafer is joined at the glass substrate to the functional wafer by anodic bonding. the electrical contact surface is disposed on a side of the functional wafer facing the cap wafer, and the cap wafer has at least one recess, such that an access is provided to the electrical contact surface. A method for encapsulating a micromechanical component having a cap wafer, by anodically bonding the cap wafer to a functional wafer.
1. A micromechanical component comprising:
a cap wafer including at least a first silicon substrate and a thin glass substrate;
a functional wafer including at least a second silicon substrate; and
at least one electrical contact surface situated on the functional wafer,
wherein the thin glass substrate of the cap wafer is joined to the functional wafer by anodic bonding,
wherein the electrical contact surface is situated on a side of the functional wafer facing the cap wafer, and
wherein the cap wafer has at least one recess extending vertically through the first silicon substrate and the thin glass substrate to the functional wafer, such that an access is provided to the electrical contact surface.
2. the micromechanical component according to claim 1 , wherein the recess is an access opening in the cap wafer in the form of a contact via.