Electronic device contact structures
Electronic device contact structures are disclosed.
1. A device, comprising:
a material body designed for use in an electronic device, the material body having a surface; and
a contact structure supported by the surface of the material body and extending from a conductive pad, the contact structure comprising:
a patterned conductive layer having an interior portion; and
a patterned insulating layer disposed between the interior portion of the patterned conductive layer and the surface of the material body, the insulating layer patterned such that the conductive layer forms an electrical contact to the material body, wherein at least a portion of the patterned insulating layer and/or the patterned conductive layer is tapered in shape,
wherein at least a portion of the patterned insulating layer is substantially triangular in shape.
2. The device of claim 1 , wherein the device is a light-emitting diode.
3. A device, comprising:
a material body designed for use in an electronic device, the material body having a surface; and
a contact structure supported by the surface of the material body and extending from a conductive pad, the contact structure comprising:
a patterned conductive layer having an interior portion; and
a patterned insulating layer disposed between the interior portion of the patterned conductive layer and the surface of the material body, the insulating layer patterned such that the conductive layer forms an electrical contact to the material body, wherein at least a portion of the patterned insulating layer and/or the patterned conductive layer is tapered in shape,
wherein the device is a photonic lattice light-emitting diode.
4. The device of claim 1 , wherein the insulating layer is patterned such that the conductive layer extends past at least one edge of the insulating layer to form an electrical contact to the material body.
5. The device of claim 1 , wherein at least a portion of the patterned insulating layer is tapered in shape.
6. The device of claim 1 , wherein at least a portion of the patterned conductive layer is tapered in shape.
7. The device of claim 3 , wherein at least a portion of the patterned insulating layer is substantially triangular in shape.
8. The device of claim 1 , wherein at least a portion of the patterned conductive layer is substantially triangular in shape.
9. The device of claim 1 , wherein the patterned conductive layer comprises a metal.
10. The device of claim 1 , wherein the patterned insulating layer comprises an oxide.
11. The device of claim 1 , wherein the patterned insulating layer has a smaller area than the patterned conductive layer.
12. The device of claim 1 , wherein the patterned insulating layer has a larger area at an end adjacent to the conductive pad than an area at a greater distance from the conductive pad.
13. The device of claim 1 , wherein a length of the patterned insulating layer is about the same as a length of the patterned conductive layer.
14. A device, comprising:
a material body designed for use in an electronic device, the material body having a surface; and
a contact structure supported by the surface of the material body and extending from a conductive pad, the contact structure comprising:
a patterned conductive layer having an interior portion; and
a patterned insulating layer disposed between the interior portion of the patterned conductive layer and the surface of the material body, the insulating layer patterned such that the conductive layer forms an electrical contact to the material body, wherein at least a portion of the patterned insulating layer and/or the patterned conductive layer is tapered in shape,
wherein the contact structure is in electrical contact to a first conductive pad and a second conductive pad.
15. A device, comprising:
a material body designed for use in an electronic device, the material body having a surface; and
a contact structure supported by the surface of the material body and extending from a conductive pad, the contact structure comprising:
a patterned conductive layer having an interior portion; and
a patterned insulating layer disposed between the interior portion of the patterned conductive layer and the surface of the material body, the insulating layer patterned such that the conductive layer forms an electrical contact to the material body,
wherein the patterned insulating layer and/or the patterned conductive layer has a larger area at an end adjacent to the conductive pad than an area at a greater distance from the conductive pad,
wherein the contact structure is in electrical contact to a first conductive pad and a second conductive pad.
16. The device of claim 15 , wherein the device is a light emitting diode.
17. A device, comprising:
a material body designed for use in an electronic device, the material body having a surface; and
a contact structure supported by the surface of the material body and extending from a conductive pad, the contact structure comprising:
a patterned conductive layer having an interior portion; and
a patterned insulating layer disposed between the interior portion of the patterned conductive layer and the surface of the material body, the insulating layer patterned such that the conductive layer forms an electrical contact to the material body,
wherein the patterned insulating layer and/or the patterned conductive layer has a larger area at an end adjacent to the conductive pad than an area at a greater distance from the conductive pad,
wherein the device is a photonic lattice light-emitting diode.
18. The device of claim 15 , wherein the insulating layer is patterned such that the conductive layer extends past at least one edge of the insulating layer to form an electrical contact to the material body.
19. The device of claim 15 , wherein at least a portion of the patterned insulating layer is tapered in shape.
20. The device of claim 15 , wherein at least a portion of the patterned conductive layer is tapered in shape.
21. The device of claim 15 , wherein at least a portion of the patterned insulating layer and/or the patterned conductive layer is substantially triangular in shape.
22. The device of claim 15 , wherein the patterned conductive layer comprises a metal.
23. The device of claim 15 , wherein the patterned insulating layer comprises an oxide.
24. The device of claim 15 , wherein the patterned insulating layer has a smaller area than the patterned conductive layer.
25. The device of claim 15 , wherein a length of the patterned insulating layer is about the same as a length of the patterned conductive layer.
26. The device as in claim 17 , wherein the contact structure is in electrical contact to a first conductive pad and a second conductive pad.
27. The device as in claim 15 , wherein the patterned insulating layer has a larger area at an end adjacent to the conductive pad than an area at a greater distance from the conductive pad.
28. The device as in claim 15 , wherein the patterned conductive layer has a larger area at an end adjacent to the conductive pad than an area at a greater distance from the conductive pad.