Electronic assembly video inspection system
An apparatus for automatically assessing the quality of a printed circuit board assembly using digitized video image analysis. The apparatus integrates with existing relatively low precision automated surface mount technology (“SMT”) manufacturing systems as an inspection station insertable at various steps in the assembly process or as a separate manually loaded station. The inspection station includes a high resolution video imaging system and a video image analyzer comprising an onboard master computer that generates control signals to reposition the camera mounted within a screen on a movable carriage and/or reposition the circuit board, and adjust the lighting; and generates individual board status data to be archived, graphically displayed on monitors or otherwise utilized by a rework station.
1. A method for automatically inspecting an assembly of a variety of components, said method comprises:
selecting a digital camera;
obtaining via said camera, an image of a variety of components on at least one region of said assembly;
scanning said image to obtain a record of observed features of said variety of components;
maintaining a database of a plurality of parameters of said features; and,
numerically analyzing each of said observed features against said parameters of said features to locate defects therein.
2. The method of claim 1 , which further comprises generating an informational display of said defects.
3. The method of claim 2 , wherein said informational display comprises graphical information.
4. The method of claim 2 , wherein said informational display comprises textual information.
5. The method of claim 1 , wherein said analyzing comprises using a numerical rule-based color image analysis algorithm.
6. The method of claim 1 , wherein said numerically analyzing comprises:
comparing said image against a record of acceptable values; and
identifying areas of said image which do not fall within said values.
7. The method of claim 1 , wherein said maintaining comprises:
entering assembly layouts including component type, locations and orientations into said database.
8. The method of claim 7 , wherein said entering comprises interpreting a computer-aided design file describing said region.
9. The method of claim 8 , which further comprises:
identifying said assembly via a visual cue on a surface of said assembly read by said camera; and
categorizing said assembly within one of a plurality of assembly types.
10. The method of claim 9 , wherein said step of obtaining comprises:
journaling said assembly along a conveyer; and
securing said assembly within view of said camera, wherein said securing has an acceptable tolerance coarser than two hundredths of an inch.
11. The method of claim 1 , wherein said obtaining comprises:
scanning a first coarse resolution image of said region;
identifying a potential defect in said region using said first coarse resolution image; and
scanning a first fine resolution image of said region containing said defect.
12. The method of claim 1 , which further comprises cataloging a list of said defects.
13. The method of claim 2 , wherein said step of generating comprises:
displaying a template representing said region;
displaying a distinct static visual icon for each of said defects at a location on said template corresponding to the location of each of said defects on said region.
14. The method of claim 13 , wherein said visual icon comprises indication of a type of defect.
15. The method of claim 1 , wherein said camera is mounted in an enclosure supported by wheels.
16. The method of claim 1 , wherein said obtaining comprises positioning said camera a distance of at least 12.7 centimeters above said region.
17. The method of claim 1 , wherein said camera is a color digitizing camera of at least 4 million pixel resolution.
18. The method of claim 1 , wherein said camera is selected from the group consisting of color cameras and monochrome cameras.
19. The method of claim 1 , wherein said components comprise surface mounted components.
20. The method of claim 1 , which further comprises obtaining multiple images of said assembly.
21. The method of claim 1 , wherein said plurality of parameters are selected from the group consisting of component type parameters, location parameters, orientation parameters and terminal lead spacing parameters.
22. The method of claim 1 , wherein said inspecting is done using a single image from a single scanned camera frame.
23. The method of claim 1 , wherein said obtaining comprises moving said camera.