IP Library Granted Patent US 7,508,750
Granted Patent B2
US 7,508,750 · App. 10/872,805 · Granted Mar 24, 2009

Apparatus and method for improving signal-to-noise ratio in a multi-carrier CDMA communication system

Assignee: Samsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 7,508,750
App. No.
10/872,805
Granted
Mar 24, 2009
Kind
B2
Abstract

For use in ause in a multi-carrier CDMA receiver, a noise reduction circuit for improving a signal-to-noise ratio of a multi-carrier signal corresponding to a predetermined sequence of chips. Each chip has a value of Logic 0 or Logic 1. The noise reduction circuit comprises a Fast Fourier Transform (FFT) circuit for receiving the multi-carrier signal and generating frequency-domain component signals. A sampling circuit generates a first sequence of samples of the frequency-domain component signals. A controller identifies samples in the first sample sequence corresponding to Logic 0 chips and identifies samples in the first sample sequence corresponding to Logic 1 chips. A randomizing circuit generates a second sample sequence by shifting positions within the first sample sequence of some of the identified samples corresponding to Logic 0 chips, or by shifting positions within the first sample sequence of some of the identified samples corresponding to Logic 1 chips.

Claims (40)

1. For use in a multi-carrier CDMA receiver, a noise reduction circuit for improving a signal-to-noise ratio of a multi-carrier signal corresponding to a predetermined sequence of chips, each of said chips having a value corresponding to Logic 0 or Logic 1, said noise reduction circuit comprising:

a Fast Fourier Transform (FFT) circuit capable of receiving said multi-carrier signal and generating a plurality of frequency-domain component signals;

a sampling circuit capable of generating a first sequence of samples of said frequency-domain component signals;

a controller capable of identifying samples in said first sequence of samples corresponding to Logic 0 chips and identifying samples in said first sequence of samples corresponding to Logic 1 chips; and

a randomizing circuit capable generating a second sequence of samples by at least one of:

shifting positions within said first sequence of samples of at least some of said identified samples corresponding to Logic 0 chips, wherein each of said shifted samples corresponding to Logic 0 chips is shifted from a first position corresponding to a Logic 0 chip to a second position corresponding to a Logic 0 chip; and

shifting positions within said first sequence of samples of at least some of said identified samples corresponding to Logic 1 chips, wherein each of said shifted samples corresponding to Logic 1 chips is shifted from a first position corresponding to a Logic 1 chip to a second position corresponding to a Logic 1 chip.

2. The noise reduction circuit as set forth in claim 1 wherein said frequency-domain component signals comprise a plurality of sinc functions.

3. The noise reduction circuit as set forth in claim 1 further comprising a combiner circuit for adding said first and second sequences of samples to generate a composite sequence of samples having a reduced signal-to-noise ratio.

4. The noise reduction circuit as set forth in claim 3 further comprising a parallel-to-serial converter circuit for converting said composite sequence of samples to said predetermined sequence of chips.

5. The noise reduction circuit as set forth in claim 4 wherein said multi-carrier CDMA receiver is disposed in a base station of a wireless network.

6. The noise reduction circuit as set forth in claim 4 wherein said CDMA receiver is disposed in a mobile station capable of communicating with a wireless network.

7. The noise reduction circuit as set forth in claim 1 wherein said randomizing circuit shifts positions of said at least some of said identified samples corresponding to Logic 0 chips according to one of a random process algorithm and a predetermined algorithm.

8. The noise reduction circuit as set forth in claim 1 wherein said randomizing circuit shifts positions of said at least some of said identified samples corresponding to Logic 1 chips according to one of a random process algorithm and a predetermined algorithm.

9. A multi-carrier CDMA wireless network comprising a plurality of base stations, each of said base stations comprising a noise reduction circuit for improving a signal-to-noise ratio of a multi-carrier signal corresponding to a predetermined sequence of chips, each of said chips having a value corresponding to Logic 0 or Logic 1, said noise reduction circuit comprising:

a Fast Fourier Transform (FFT) circuit capable of receiving said multi-carrier signal and generating a plurality of frequency-domain component signals;

a sampling circuit capable of generating a first sequence of samples of said frequency-domain component signals;

a controller capable of identifying samples in said first sequence of samples corresponding to Logic 0 chips and identifying samples in said first sequence of samples corresponding to Logic 1 chips; and

a randomizing circuit capable generating a second sequence of samples by at least one of:

shifting positions within said first sequence of samples of at least some of said identified samples corresponding to Logic 0 chips, wherein each of said shifted samples corresponding to Logic 0 chips is shifted from a first position corresponding to a Logic 0 chip to a second position corresponding to a Logic 0 chip; and

shifting positions within said first sequence of samples of at least some of said identified samples corresponding to Logic 1 chips, wherein each of said shifted samples corresponding to Logic 1 chips is shifted from a first position corresponding to a Logic 1 chip to a second position corresponding to a Logic 1 chip.

10. The multi-carrier CDMA wireless network as set forth in claim 9 wherein said frequency-domain component signals comprise a plurality of sinc functions.

11. The multi-carrier CDMA wireless network as set forth in claim 9 further comprising a combiner circuit for adding said first and second sequences of samples to generate a composite sequence of samples having a reduced signal-to-noise ratio.

12. The multi-carrier CDMA wireless network as set forth in claim 11 further comprising a parallel-to-serial converter circuit for converting said composite sequence of samples to said predetermined sequence of chips.

13. The multi-carrier CDMA wireless network as set forth in claim 12 wherein said multi-carrier CDMA receiver is disposed in a base station of a wireless network.

14. The multi-carrier CDMA wireless network as set forth in claim 12 wherein said CDMA receiver is disposed in a mobile station capable of communicating with a wireless network.

15. The multi-carrier CDMA wireless network as set forth in claim 9 wherein said randomizing circuit shifts positions of said at least some of said identified samples corresponding to Logic 0 chips according to one of a random process algorithm and a predetermined algorithm.

16. The multi-carrier CDMA wireless network as set forth in claim 9 wherein said randomizing circuit shifts positions of said at least some of said identified samples corresponding to Logic 1 chips according to one of a random process algorithm and a predetermined algorithm.

17. For use in a multi-carrier CDMA receiver, a method of improving a signal-to-noise ratio of a multi-carrier signal corresponding to a predetermined sequence of chips, each of the chips having a value corresponding to Logic 0 or Logic 1, the method comprising the steps of:

in a Fast Fourier Transform (FFT) circuit, receiving the multi-carrier signal and generating a plurality of frequency-domain component signals;

generating a first sequence of samples of the frequency-domain component signals;

identifying samples in the first sequence of samples corresponding to Logic 0 chips and identifying samples in the first sequence of samples corresponding to Logic 1 chips; and

generating a second sequence of samples by at least one of:

shifting positions within the first sequence of samples of at least some of the identified samples corresponding to Logic 0 chips, wherein each of the shifted samples corresponding to Logic 0 chips is shifted from a first position corresponding to a Logic 0 chip to a second position corresponding to a Logic 0 chip; and

shifting positions within the first sequence of samples of at least some of the identified samples corresponding to Logic 1 chips, wherein each of the shifted samples corresponding to Logic 1 chips is shifted from a first position corresponding to a Logic 1 chip to a second position corresponding to a Logic 1 chip.

18. The method as set forth in claim 17 wherein the frequency-domain component signals comprise a plurality of sinc functions.

19. The method as set forth in claim 17 further comprising the step of adding the first and second sequences of samples to generate a composite sequence of samples having a reduced signal-to-noise ratio.

20. The method as set forth in claim 19 further comprising the step of converting the composite sequence of samples from parallel data to the predetermined sequence of chips.

21. The method as set forth in claim 17 wherein the step of shifting positions within the first sequence of samples of at least some of the identified samples corresponding to Logic 1 chips comprises the step of shifting positions of the at least some of the identified samples corresponding to Logic 1 chips according to one of a random process algorithm and a predetermined algorithm.

22. The method as set forth in claim 17 wherein the step of shifting positions within the first sequence of samples of at least some of the identified samples corresponding to Logic 0 chips comprises the step of shifting positions of the at least some of the identified samples corresponding to Logic 0 chips according to one of a random process algorithm and a predetermined algorithm.

Assignments (6)
RELEASE OF SECURITY INTEREST RECORDED AT REEL 052159, FRAME 0208 Recorded Sep 13, 2024
From: BANK OF AMERICA, N.A.
To: SAUDER WOODWORKING CO.; SAUDER MANUFACTURING CO.
Reel/Frame 068967/0728 →
PATENT SECURITY AGREEMENT Recorded Mar 12, 2020
From: SAUDER WOODWORKING CO.; SAUDER MANUFACTURING CO.
To: BANK OF AMERICA, N.A.
Reel/Frame 052159/0208 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2007
From: O'SULLIVAN INDUSTRIES, INC.
To: SAUDER WOODWORKING CO.
Reel/Frame 019501/0846 →
SECURITY AGREEMENT Recorded Apr 5, 2007
From: O'SULLIVAN INDUSTRIES, INC.
To: WILMINGTON TRUST COMPANY AS COLLATERAL AGENT
Reel/Frame 019116/0589 →
SECURITY AGREEMENT Recorded Apr 21, 2006
From: O'SULLIVAN INDUSTRIES, INC.
To: WACHOVIA BANK, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 017507/0488 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2004
From: CLEVELAND, JOSEPH R.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 015512/0301 →
Continuity (2)
Continuation In Part 1084125600 · May 7, 2004
Related Publication 20050249109A1 · Nov 10, 2005