Potting shell
A potting shell, for an electronic circuit on a circuit board, comprises a wall arrangement, which defines a shell volume at least in one spatial direction and in the directions perpendicular thereto; wherein the circuit board is positionable in the shell volume, and can be potted in the shell volume with a potting compound. The volume between the circuit board and a main wall of the potting shell, running essentially parallel, at least sectionally, to the circuit board, can be filled with a potting compound, characterized in that the main wall has at least one flexible section, which, based on a thermal expansion of the potting compound, can be deformed perpendicular to the plane of the flexible section.
1. A potting shell for a populated circuit board, including:
a wall arrangement with a main wall, said wall arrangement defines a shell volume at least in one spatial direction, and in the directions perpendicular thereto, wherein:
the circuit board is positionable in the shell volume, and can be potted in the shell volume with a potting compound;
the volume between the circuit board and a main wall of the potting shell, running essentially parallel, at least sectionally, to the circuit board, can be filled with a potting compound; and
said main wall has at least one flexible section, which, based on a thermal expansion of the potting compound, can be deformed perpendicular to the plane of said flexible section.
2. The potting shell as claimed in claim 1 , wherein:
said flexible section has a lesser wall thickness than other wall sections of the potting shell.
3. The potting shell as claimed in claim 2 , wherein:
the wall thickness in said flexible section amounts to not more than 80% of the wall thickness outside of said flexible section.
4. The potting shell as claimed in claim 2 , wherein:
the wall thickness in said flexible section amounts to not more than 80% of the wall thickness outside of said flexible section.
5. The potting shell as claimed in claim 2 , wherein:
the wall thickness in said flexible section amounts to not more than 80% of the wall thickness outside of said flexible section.
6. The potting shell as claimed in claim 1 , wherein:
the exterior side of said main wall defines at least one support surface; and
said at least one flexible section is recessed with respect to said support surface.
7. The potting shell as claimed in claim 1 , wherein:
said flexible section, in its center, can absorb at least 50% of the thermal expansion of the potting compound perpendicular to the plane of said flexible section.
8. The potting shell as claimed in claim 1 , wherein:
said main wall, outside of said flexible section, has at least one opening for electrical feed-throughs; and
said at least one opening is surrounded on the exterior side of the potting shell, and/or on its interior side, by an elastic seal.
9. The potting shell as claimed in claim 8 , wherein:
said at least one opening is surrounded on the interior side by a protrusion, which extends from said main wall into the interior of the potting shell; and
said elastic seal is arranged on the protrusion.
10. The potting shell as claimed in claim 8 , wherein:
said at least one opening is surrounded on the interior side by a protrusion, which extends from said main wall into the interior of the potting shell; and
said elastic seal is arranged on the protrusion; and
wherein the circuit board presses against said seal on the interior side of the potting shell.
11. The potting shell as claimed in claim 8 , wherein:
said at least one opening is surrounded on the interior side by a protrusion, which extends from said main wall into the interior of the potting shell; and
said elastic seal is arranged on the protrusion; and
wherein the circuit board presses against said seal on the interior side of the potting shell.
12. The potting shell as claimed in claim 1 , wherein:
the exterior side of said main wall defines at least one support surface; and
said at least one flexible section is recessed with respect to said support surface.
13. The potting shell as claimed in claim 1 , wherein:
said flexible section, in its center, can absorb at least 50% of the thermal expansion of the potting compound perpendicular to the plane of said flexible section.
14. The potting shell as claimed in claim 1 , wherein:
said main wall, outside of said flexible section, has at least one opening for electrical feed-throughs; and
said at least one opening is surrounded on the exterior side of the potting shell, and/or on its interior side, by an elastic seal;
and wherein the circuit board presses against said seal on the interior side of the potting shell.
15. The potting shell as claimed in claim 1 , wherein:
the exterior side of said main wall defines at least one support surface; and
said at least one flexible section is recessed with respect to said support surface.
16. The potting shell as claimed in claim 1 , wherein:
said flexible section, in its center, can absorb at least 50% of the thermal expansion of the potting compound perpendicular to the plane of said flexible section.
17. The potting shell as claimed in claim 1 , wherein:
said main wall, outside of said flexible section, has at least one opening for electrical feed-throughs; and
said at least one opening is surrounded on the exterior side of the potting shell, and/or on its interior side, by an elastic seal;
and wherein the circuit board presses against said seal on the interior side of the potting shell.
18. An electronics module, comprising:
a populated circuit board, which is arranged in a potting shell, and is potted therein with potting compound;
said potting shell including:
a wall arrangement with a main wall, said wall arrangement defines a shell volume at least in one spatial direction, and in the directions perpendicular thereto, wherein:
the circuit board is positionable in the shell volume, and can be potted in the shell volume with a potting compound;
the volume between the circuit board and a main wall of the potting shell, running essentially parallel, at least sectionally, to the circuit board, can be filled with a potting compound; and
said main wall has at least one flexible section, which, based on a thermal expansion of the potting compound, can be deformed perpendicular to the plane of said flexible section.
19. The electronics module, as claimed in claim 18 , wherein:
said flexible section has a lesser wall thickness than other wall sections of the potting shell.
20. The electronics module, as claimed in claim 18 , wherein:
said flexible section has a lesser wall thickness than other wall sections of the potting shell.
21. A measuring transmitter for registering a process parameter, comprising:
a housing, in which an electronics module, is arranged which includes:
a wall arrangement with a main wall, said wall arrangement defines a shell volume at least in one spatial direction, and in the directions perpendicular thereto, wherein:
the circuit board is positionable in the shell volume, and can be potted in the shell volume with a potting compound;
the volume between the circuit board and a main wall of the potting shell, running essentially parallel, at least sectionally, to the circuit board, can be filled with a potting compound; and
said main wall has at least one flexible section, which, based on a thermal expansion of the potting compound, can be deformed perpendicular to the plane of said flexible section.
22. The measuring transmitter as claimed in claim 21 , wherein the process parameter comprises pressure, pressure difference, fill level, flow rate, temperature, pH-value, redox potential, humidity, turbidity, or gas content in a liquid.