Granted Patent
S1
US 756,942 · App. 29/526,620 · Granted May 24, 2016
Light-emitting diode package
Inventors:
Junpeng Shi (Xiamen, CN); Pei-Song Cai (Xiamen, CN); Zhenduan Lin (Xiamen, CN); Hao Huang (Xiamen, CN)
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Claims (1)
The ornamental design for a light-emitting diode package, substantially as shown and described.
Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Oct 20, 2023
From: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
To: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 065302/0223 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded May 12, 2015
From: SHI, JUNPENG; CAI, PEI-SONG; LIN, ZHENDUAN; HUANG, HAO
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
Reel/Frame 035616/0289 →
Priority Claims (1)
CN 2015 3 0129449
· May 6, 2015
· national