High power light-emitting diode package comprising substrate having beacon
Disclosed herein is a package structure including at least one high power light-emitting diode to exhibit excellent heat release properties. In the package structure, a light-emitting diode chip which generates heat is directly attached to a beacon processed to protrude from part of a heat spreader having high heat conductivity, whereby an electrical wiring portion is separated from a heat release portion, thus maximizing heat release properties and realizing high luminance and reliability. The package structure is composed of a beacon formed on a metal or non-metal substrate having high heat conductivity to mount a high power light-emitting diode chip, to increase heat release properties; a wiring portion provided on the same line as the diode to input and output power and signals; and a reflection cup having a cavity, which may be inserted into or attached to the heat spreader or the wiring substrate, including a low temperature co-fired ceramic substrate, a high temperature co-fired ceramic substrate, or a printed circuit board.
1. A high power light-emitting diode package comprising a substrate having a beacon, comprising:
a high power light-emitting diode to emit light;
a heat spreader to release heat generated from the high power light-emitting diode and including a beacon formed thereon for mounting of the high power light-emitting diode;
a wiring substrate to supply external electric power to the high power light-emitting diode;
a reflection cup to increase emission efficiency of light emitted form the high power light-emitting diode; and
a condition preventing layer formed between the wiring substrate and the reflection cup to prevent electrical conduction therebetween.
2. The package as set forth in claim 1 , wherein a number of beacons formed on a single heat spreader is one or more.
3. The package as set forth in claim 1 , wherein a number of high power light-emitting diodes mounted on a single beacon is one or more.
4. The package as set forth in claim 1 , further comprising a connector to input external signals and electric power.
5. The package as set forth in claim 1 , wherein a vertical section of the beacon comprises any one shape selected from a planar shape, a groove shape, and a stepped shape.
6. The package as set forth in claim 1 , wherein the heat spreader is plated with nickel to form a nickel plated layer, which is then plated with silver or gold, upon bonding with the wiring substrate.
7. The package as set forth in claim 1 , wherein the reflection cup is plated with silver to increase reflectance and luminance.
8. The package as set forth in claim 1 , further comprising a phosphor formed on the high power light-emitting diode to determine color of light emitted from the high power light-emitting diode.
9. The package as set forth in claim 8 , further comprising an encapsulant provided on the phosphor.
10. The package as set forth in claim 1 , further comprising an insulating layer formed between the wiring substrate and the heat spreader to prevent short-circuit therebetween.
11. The package as set forth in claim 10 , wherein the insulating layer is formed of any one material selected from among low temperature co-fired ceramic, high temperature co-fired ceramic, ceramic, FR-4, epoxy, and mixtures thereof.
12. The package as set forth in claim 10 , wherein the insulating layer has a thickness of 50 mm or more.