Monolithic transmitter photonic integrated circuit (TxPIC) with a traversely disposed output
A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
1. A photonic integrated circuit chip comprising:
a plurality of optical sources, each of the plurality of optical sources having a length extending in a first direction, each of the plurality of optical sources providing a corresponding one of a plurality of optical signals at a respective one of a plurality of wavelengths;
an optical combiner having a plurality of inputs and an output, each of the plurality of inputs configured receive a corresponding one of the plurality of optical signals, the optical combiner configured to combine the plurality of optical signals into a multiplexed output signal and supply the multiplexed output signal at the output of the optical combiner; and
an output waveguide having a first end portion, a second end portion, and a longitudinal axis extending through the first and second end portions, the first end portion of the output waveguide coupled to the output of the optical combiner and the second end portion of the output waveguide extending to a facet of the chip, the longitudinal axis of the output waveguide in the second end portion of the output waveguide extending in a second direction, the second direction being substantially perpendicular to the first direction.
2. The photonic integrated circuit chip of claim 1 , wherein each of the plurality of optical sources includes a directly modulated laser.
3. The photonic integrated circuit chip of claim 2 , wherein each of the lasers is a DFB laser.
4. The photonic integrated circuit chip of claim 1 , wherein the plurality of optical sources includes a plurality of laser sources and a plurality of electro-optic modulators, each of the plurality of electro-optic modulators being coupled to a corresponding one of the plurality of laser sources.
5. The photonic integrated circuit chip of claim 4 , wherein each of the plurality of laser sources is a DFB laser.
6. The photonic integrated circuit chip of claim 4 , wherein each of the plurality of electro-optic modulators is a corresponding one of a plurality of electro-absorption modulators.
7. The photonic integrated circuit chip of claim 1 , wherein the optical combiner is a wavelength selective combiner.
8. The photonic integrated circuit chip of claim 7 wherein the wavelength selective combiner is an arrayed waveguide grating.
9. The photonic integrated circuit chip of claim 1 , wherein the facet of the chip has a planar surface, the longitudinal axis of the output waveguide in the second portion of the output waveguide forming an angle with the planar surface of the facet.
10. The photonic integrated circuit chip of claim 9 , wherein the angle is about 83°.
11. A photonic integrated circuit chip comprising:
a plurality of optical sources, each of the plurality of optical sources providing a corresponding one of a plurality of optical signals;
an optical combiner having a plurality of inputs, each of the plurality of inputs optically coupled to a corresponding one of the plurality of optical signals and supply a multiplexed output signal on an output from the optical combiner;
an output waveguide having a first end portion, a second end portion, and a longitudinal axis extending through the first and second end portions, the first end portion of the output waveguide being coupled to the output of the optical combiner, and the second end portion of the output waveguide extending to a facet of the chip,
each of the plurality of optical sources having a length extending in a first direction, the longitudinal axis in the second end portion of the output waveguide extending in a second direction, the second direction being substantially perpendicular to the first direction.
12. The photonic integrated circuit chip of claim 11 , wherein each of the plurality of optical signals has a corresponding one of a plurality of wavelengths.
13. The photonic integrated circuit chip of claim 11 , wherein each of the plurality of optical sources is a corresponding one of a plurality of directly modulated laser sources.
14. The photonic integrated circuit chip of claim 13 , wherein each of the plurality of laser sources is a DFB laser.
15. The photonic integrated circuit chip of claim 13 , wherein each of the plurality of electro-optic modulators is an electro-absorption modulator.
16. The photonic integrated circuit chip of claim 11 , wherein the optical combiner is a wavelength selective combiner.
17. The photonic integrated circuit chip of claim 16 , wherein the wavelength selective combiner is an arrayed waveguide grating.
18. The photonic integrated circuit chip of claim 11 , wherein the facet of the chip has a planar surface, the planar surface having a length in a third direction, the third direction being substantially parallel to the first direction.
19. The photonic integrated circuit chip of claim 2 , wherein each of the lasers is a DBR laser.
20. The photonic integrated circuit chip of claim 4 , wherein each of the plurality of laser sources is a DBR laser.
21. The photonic integrated circuit chip of claim 4 , wherein each of the plurality of electro-optic modulators is a corresponding one of a plurality of Mach-Zehnder modulators.
22. The photonic integrated circuit chip of claim 7 wherein the wavelength selective combiner is an Echelle grating.
23. The photonic integrated circuit chip of claim 16 , wherein the wavelength selective combiner is an Echelle grating.
24. The photonic integrated circuit chip of claim 11 , wherein the plurality of optical sources includes a plurality of laser sources and a plurality of electro-optic modulators, each of the plurality of laser sources being optically coupled to a respective one of the plurality of electro-optic modulators.
25. The photonic integrated circuit chip of claim 13 , wherein each of the plurality of laser sources is a DBR laser.
26. The photonic integrated circuit chip of claim 13 , wherein each of the plurality of electro-optic modulators is a Mach-Zehnder modulator.