Packaging designs for LEDs
Light-emitting devices, and related components, processes, systems and methods are disclosed.
1. A system comprising:
an LED having an edge, the LED being capable of emitting light; and
a layer positioned at a distance from a surface of the LED, the distance being at most about 10% of the length of the edge, the layer being configured so that at least about 75% of the light that emerges from the LED and impinges on the layer passes through the layer,
wherein the layer is a window of a package and includes an electrical contact, and
the package further comprises a substrate and a conductive pad on the substrate,
wherein the electrical contact of the layer is electrically connected to the conductive pad of the package via a metal spring or clip.
2. The system of claim 1 , wherein the LED comprises a multi-layer stack of materials comprising a first layer supported by a light generating region, a surface of the first layer being configured so that light generated by the light generating region can emerge from the LED via a surface of the first layer.
3. The system of claim 2 , wherein the surface of the first layer includes a plurality of holes arranged according to a nonperiodic pattern.
4. The system of claim 1 , wherein the LED has an edge that is at least about one millimeter long.
5. The system of claim 1 , wherein an aspect ratio of the surface of the LED is about 4×3.
6. The system of claim 1 , wherein an aspect ratio of the surface of the LED is about 16×9.
7. The system of claim 1 , further comprising a cooling system configured so that, during use, the cooling system regulates a temperature of the LED.
8. The system of claim 1 , wherein the LED includes an electrical contact and the electrical contact of the layer is electrically connected to the electrical contact of the LED.
9. The system of claim 8 , wherein the electrical contact of the layer is patterned.
10. The system of claim 8 , wherein the electrical contact of the layer is electrically connected to the electrical contact of the LED via conductive supports.
11. The system of claim 10 , wherein the conductive supports comprise solder.
12. The system of claim 1 , wherein the layer comprises glass.
13. The system of claim 1 , wherein the LED is free of wire bonds.
14. The system of claim 1 , wherein the LED includes a light generating region comprising quantum wells.