Method for the fabrication of conductive electronic features
Precursor compositions in the form of a tape that can be transferred to a substrate and converted to an electronic feature at a relatively low temperature, such as not greater than about 200° C. The tape composition can be disposed on a carrier to form a ribbon structure that is flexible and can be handled in a variety of industrial processes.
1. A method for the fabrication of a conductive electronic feature on a substrate, comprising the steps of:
(a) providing a substrate;
(b) providing a ribbon structure comprising a tape composition on a carrier, said tape composition comprising a molecular precursor compound of a metal;
(c) transferring said tape composition from said carrier to said substrate in a pattern of features; and
(d) heating said transferred tape composition to a temperature of not greater than about 200° C. to convert said tape composition to a conductive feature having a resistivity of not greater than 100 times the resistivity of said metal.
2. A method as recited in claim 1 , wherein said conductive feature has a minimum feature size of not greater than 100 μm.
3. A method as recited in claim 1 , wherein said conductive feature has a minimum feature size of not greater than 75 μm.
4. A method as recited in claim 1 , wherein said conductive feature has a minimum feature size of not greater than 50 μm.
5. A method as recited in claim 1 , wherein said conductive feature has a minimum feature size of not greater than 25 μm.
6. A method as recited in claim 1 , wherein said conductive feature has a minimum feature size of not greater than 10 μm.
7. A method as recited in claim 1 , wherein said tape composition comprises polymer or polymer precursor, metal particles, and metal compound.
8. A method as recited in claim 1 , wherein said conductor tape composition comprises metal particles.
9. A method as recited in claim 1 , wherein said tape composition comprises silver particles.
10. A method as recited in claim 1 , wherein said tape composition comprises copper particles.
11. A method as recited in claim 1 , wherein said substrate is a polymer substrate.
12. A method as recited in claim 1 , wherein said substrate is selected from the group consisting of polyfluorinated compounds, polyimides, epoxies, polycarbonate, cellulose-based materials, acetate, polyester, polyethylene, polypropylene, polyvinyl chloride, acrylonitrile, butadiene (ABS), flexible fiber board, non-woven polymeric fabric and cloth.
13. A method as recited in claim 1 , wherein said substrate is a glass.
14. A method as recited in claim 1 , wherein said molecular precursor compound is a silver compound.
15. A method as recited in claim 1 , wherein said molecular precursor compound is a copper compound.
16. A method as recited in claim 1 , wherein said transfer step comprises using pressure to initiate transfer.
17. A method as recited in claim 1 , wherein said transfer step comprises melting a binder in said tape composition to initiate transfer.
18. A method as recited in claim 1 , wherein said transfer step comprises a chemical reaction within said ribbon structure to initiate transfer.
19. A method as recited in claim 1 , wherein said transfer step comprises generating a vapor phase within said ribbon structure to initiate transfer.
20. A method as recited in claim 1 , wherein said transfer step comprises using mechanical force to initiate transfer.
21. A method as recited in claim 1 , wherein said transfer step comprises using heat to initiate transfer.
22. A method as recited in claim 1 , wherein a combination of physical and thermal forces are used to initiate transfer.
23. A method as recited in claim 1 , wherein said conductive feature comprises a polymer and metal.
24. A method as recited in claim 23 , wherein said polymer comprises polyimide.
25. A method as recited in claim 1 , wherein said conductive feature comprises substantially pure metal.
26. A method as recited in claim 1 , wherein said heating step comprises heating to a temperature of not greater than about 175° C.
27. A method as recited in claim 1 , wherein said heating step comprises heating to a temperature of not greater than about 150° C.
28. A method as recited in claim 1 , wherein said heating step comprises heating to a temperature of not greater than about 125° C.
29. A method as recited in claim 1 , wherein said conductive feature has a resistivity of not greater than about 50 times the resistivity of bulk silver.
30. A method as recited in claim 1 , wherein said conductive feature has a resistivity of not greater than about 10 times the resistivity of bulk silver.
31. A method as recited in claim 1 , wherein said conductive feature has a resistivity of not greater than about 5 times the resistivity of bulk silver.
32. A method as recited in claim 1 , wherein said conductive feature is patterned on said substrate to form a printed circuit board.
33. A method as recited in claim 1 , wherein said conductive feature is patterned on said substrate to form bus lines for a flat panel display.
34. A method as recited in claim 1 , wherein said conductive feature is patterned on said substrate to form under bump metallization.
35. A method for the fabrication of a conductive electronic feature on a substrate, comprising the steps of:
(a) providing a substrate;
(b) providing a ribbon structure comprising a tape composition on a carrier, said tape composition comprising a molecular precursor compound to a metal;
(c) transferring said tape composition from said carrier of said substrate in a pattern of features; and
(d) heating said transferred tape composition to a temperature of not greater than about 175° C. to convert said tape composition to a conductive feature having a resistivity of not greater than 10 times the resistivity of said metal.
36. A method for the fabrication of a conductive electronic feature on a substrate, comprising the steps of:
(a) providing a substrate;
(b) providing a ribbon structure comprising a tape composition on a carrier, said tape composition comprising a molecular precursor compound to a metal;
(c) transferring said tape composition from said carrier of said substrate in a pattern of features; and
(d) heating said transferred tape composition to a temperature of not greater than about 200° C. to convert said tape composition to a conductive feature having a resistivity of not greater than 6 times the resistivity of said metal.
37. A method as recited in claim 36 , wherein said heating step comprises heating to a temperature of not greater than about 175° C.