Stackable semiconductor package and method for its fabrication
A stackable semiconductor package includes a board having first electrical connections, an integrated circuit chip fixed on a front face of the board, second electrical connections which connect the chip to the first electrical connections of the board and front electrical contact terminals arranged beyond at least one edge of the chip on the front face of this board. An encapsulation block of a coating material is formed on the front face of the board and encapsulates the chip, its electrical connections and the front terminals. The block has at least one opening which at least partially uncovers the front terminals with a view to receiving electrical connection beads of a stacked second package. This one opening is preferably in the form of a groove.
1. A semiconductor package comprising:
a board having electrical connection means, an integrated circuit chip fixed on a front face of the board, means for electrically connecting the chip to the electrical connection means of the board, wherein the electrical connection means of the board comprise front electrical contact terminals arranged beyond at least one edge of the chip on the front face of the board;
an encapsulation block of a coating material formed on the front face of the board and encapsulating the chip, the electrical connection means and the front electrical contact terminals, the block having at least one opening which at least partially uncovers plural ones of the front electrical contact terminals;
wherein the at least one opening comprises a groove formed in the encapsulation block, the groove extending over and uncovering the plural ones of the front electrical contact terminals; and
wherein the plural ones of the front electrical contact terminals are aligned in at least one row, the groove comprising a straight groove extending over and uncovering this row of front electrical contact terminals.
2. The package according to claim 1 , wherein the groove extends parallel to a first side of the encapsulation block, and ends of the groove open onto two opposite sides of the encapsulation block that are adjacent the first side.
3. A semiconductor package, comprising:
a board having electrical connection means, an integrated circuit chip fixed on a front face of the board, means for electrically connecting the chip to the electrical connection means of the board, wherein the electrical connection means of the board comprise front electrical contact terminals arranged beyond at least one edge of the chip on the front face of the board;
an encapsulation block of a coating material formed on the front face of the board and encapsulating the chip, the electrical connection means and the front electrical contact terminals, the block having at least one opening which at least partially uncovers plural ones of the front electrical contact terminals;
wherein the at least one opening comprises a groove formed in the encapsulation block, the groove extending over and uncovering the plural ones of the front electrical contact terminals; and
further comprising four rows of front electrical contact terminals encircling the chip along four sides of the encapsulation block and four grooves along the four sides which uncover the front electrical contact terminals of these rows of front electrical contact terminals, pairs of these grooves crossing each other at corners of the encapsulation block.
4. The package according to claim 1 , wherein the front electrical contact terminals are covered respectively with a layer of a soft electrically conductive material.
5. The package according to claim 4 , wherein the soft material is a soldering paste.
6. A stack of at least two semiconductor packages, comprising:
a first semiconductor package including an encapsulation block wherein at least one straight groove is formed in a top surface of the encapsulation block, the straight groove extending over and at least partially uncovering a row of front terminals; and
a second semiconductor package arranged above the encapsulation block of the first semiconductor package; and
an electrical connection formed between the first and second semiconductor packages by electrical connection beads arranged to be received within the straight groove in the encapsulation block to make electrical contact between a bottom surface of the second semiconductor package and the front terminals uncovered by the straight groove in the encapsulation block of the first semiconductor package.
7. The stack of claim 6 , wherein the bottom surface of the second semiconductor package is in contact with the top surface of the encapsulation block for the first semiconductor package.
8. The stack of claim 7 , further including an adhesive for fixing the bottom surface of the second semiconductor package to the top surface of the encapsulation block.
9. The stack of claim 6 , further including an electrically conductive paste-like material layer associated with the front terminals.
10. A semiconductor package comprising:
a board having electrical contact terminals on a front face of the board;
an integrated circuit chip fixed on the front face of the board and electrically connected to the electrical contact terminals, wherein the electrical contact terminals are arranged on the front face of the board at locations outside at least one edge of the chip;
an encapsulation block of a coating material formed on the front face of the board and encapsulating both the chip and the electrical contact terminals, the encapsulation block having at least one groove formed in a top surface of the encapsulation block which extends through the encapsulation block to expose plural ones of the electrical contact terminals on the front face of the board; and
wherein at least some of the electrical contact terminals are aligned in at least one row, and wherein the groove formed in the top surface comprises a straight groove which uncovers this row of electrical contact terminals.
11. The package according to claim 10 , wherein each of a first and second end of the straight groove opens onto opposite side edges of the encapsulation block.
12. The package according to claim 10 , further comprising four rows of electrical contact terminals about a perimeter of the chip, the opening formed in the top surface comprising four corresponding straight grooves which uncover the rows of electrical contact terminals.
13. The package according to claim 10 , wherein the electrical contact terminals are covered with a layer of a soft electrically conductive paste material positioned between the electrical contact terminals and the encapsulation block, the soft electrically conductive paste material being uncovered by the opening.
14. The package according to claim 13 , wherein the soft material is a soldering paste.
15. A semiconductor package comprising:
a board having electrical contact terminals, an integrated circuit chip fixed on a front face of the board, electrical connections between the chip and the electrical contact terminals of the board, wherein the electrical contact terminals are arranged in a first row and a second row beyond at least one edge of the chip on the front face of the board;
an encapsulation block of a coating material formed on the front face of the board and encapsulating the chip, the electrical connections and the electrical contact terminals, the block having a first groove extending along a first side of the encapsulation block which at least partially uncovers the first row of electrical contact terminals, and having a second groove extending along a second side of the encapsulation block which at least partially uncovers the second row of electrical contact terminals.
16. The package of claim 15 wherein the first and second sides are adjacent, and the first and second grooves intersect each other at a corner of the encapsulation block.
17. The package of claim 15 wherein the first and second sides are opposite each other for the encapsulation block.